A Novel Twin External Rotating Cathode

Abstract

The invention discloses a novel twin external rotating cathode, which comprises a common target sleeve, a twin cooling water system, a common technical gas inlet system, a twin weight equalizer system, a common rotary power system, a twin electric power access system, a twin observation window and a common security protection hood, wherein a motor of the common rotary power system drives the common target sleeve to rotate at the same speed through a synchronous belt synchronizing wheel; the common technical gas inlet system introduces working gas to keep the vacuum in the working vacuum degree; and the twin electric power access system is used for accessing corresponding high voltage, so that the gas is ionized into plasma, thereby carrying out magnetron sputtering coating in a balanced magnetic field provided by the twin weight equalizer system. By adopting the linear twin rotating cathode design, the novel large-area twin external rotating cathode has the characteristics of high deposition rate, wide uniform settling region, high target utilization ratio and high technical stability, and can implement continuous target face self-cleaning and arbitrary-angle installation.

Description

technical field [0001] The invention relates to a novel twin external rotating cathode, in particular to a novel twin external rotating cathode which adopts a balanced magnetic field design and can be installed on various vacuum chambers at any angle. Background technique [0002] Magnetron sputtering coating is the most widely used coating technology in the field of large-area thin film material deposition. Due to the process stability of magnetron sputtering coating, it is widely used in the field of large-area optical coating, large-area architectural glass coating, large-area conductive film and large-area semiconductor coating. It is also because of the wide application of this technology in the fields of curtain wall decoration, large-area flat panel display, semiconductor deposition, large-area architectural glass, automotive coating, solar cells, solar thermal, large-area optical coating and large-area conductive film, magnetron sputtering Shooting technology has al...

AI Technical Summary

Problems solved by technology

Even the deposition area and the reaction area can be completely separated by the movement of the substrate frame. The equipment structure and the film formation process of metal oxides that adopt this process work are described in detail in the Chinese Patent Publication No. CN1536098A. This process first Sputtering is used to deposit metal in one area, and the compound insulating dielectric film is formed by reaction in another area. Although this can obtain a high metal deposition rate, it is also affected by the slow formation rate of metal compounds.

Images