Method for monitoring fuse burning yield rate in chip test
A technology of chip testing and fuse burning, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as test product loss, and achieve the effect of avoiding irreversible loss
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[0024] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0025] In this embodiment, the method for monitoring the achievement rate of burning the fuse in the chip test includes the following steps:
[0026] Step S1, establish a fuse truth table, as shown in the following table;
[0027]
[0028] In this example, the number of fuses is four sections. After a certain section of fuse is blown, the change in the reference voltage of the chip has been specified in advance during the fuse design process. In this example, the changes in the reference voltage after each section of fuse is blown are respectively : -12.5mV(T3-GND), -25mV(T2-GND), -50mV(T1-GND), +100mV(T0-GND); T0-GND, T1-GND, T2-GND, T3-GND represent Four section fuse;
[0029] The fuse truth table has a minimum reference value of 500mv and a maximum reference value of 700mv; the fuse truth table also has a reference voltage standard value of 600mv; If t...
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