High positioning accuracy lenses Interchangeable photoetched objective lens frame

Abstract

The replaceable lithography objective lens frame with high positioning accuracy lens belongs to the field of deep ultraviolet projection lithography objective lens structure design and adjustment technology, and aims to solve the existing problems of complex structure, large operating space, low positioning and repeat positioning accuracy and lens susceptible to contamination. The outer mirror frame of the present invention has a cylindrical structure, two side walls inside the outer mirror frame are provided with slide grooves, a conical groove and a V-shaped groove are arranged on the inner side wall, and a ball head A is arranged on the inner upper end surface of the outer mirror frame near the opening; The mirror frame is a square structure, and slide rails are set on any two opposite side walls, and two ball heads B are set on the side wall adjacent to the side wall where the slide rails are located. The positions of the two ball heads B are respectively aligned with the conical groove Corresponding to the V-shaped groove, there is an upper platform at the position corresponding to the upper end surface of the square structure and the ball head A; the slide rail of the inner mirror frame cooperates with the slide groove in the outer mirror frame, and a protective cover is arranged on the outer side of the inner mirror frame, and the protective cover and the outer mirror frame The connection is secured by screws.

Description

Technical field [0001] The invention belongs to the technical field of deep-ultraviolet projection lithography objective lens structure design and assembly and adjustment, and in particular relates to a lithography objective lens frame for fine repair, maintenance, replacement and repeated positioning of optical elements in a lithography projection objective lens system. Background technique [0002] Projection lithography objective lens is a key equipment for manufacturing large-scale integrated circuits. In recent years, with the continuous subdivision of the characteristic line width of integrated circuits, the resolution of projection lithography objectives has gradually improved. At present, the ArF excimer laser projection lithography equipment with a wavelength of 193.368nm has become a 90nm, 65nm and 45nm node integrated circuit manufacturing equipment. Mainstream equipment. The projection lithography objective lens system has extremely high requirements on the surface a...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a lithography objective lens frame with replaceable lens of high positioning accuracy, which solves the problems of complex structure, large operating space, low positioning and repeat positioning accuracy and easy contamination of the lens in the prior art

Images