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Polyamide resin, and preparation method therefor and molded product thereof

A polyamide resin and post-polymerization technology, applied in the field of polyamide resin, can solve the problems such as the relative viscosity of polyoxamide resin cannot be improved, the viscosity of polyoxamide resin is decreased, and the melt retention stability is not improved.

Active Publication Date: 2016-03-30
TORAY ADVANCED MATERIALS RES LAB CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the PA62 / 2-M52 resin described in Patent Document 1 (WO2011 / 136263), the relative viscosity of the polyoxamide resin with a melting point above 280° C. has not been able to be improved (relative viscosity is lower than 2.05), and the resin’s relative viscosity during melt processing Viscosity will drop dramatically
Although the PA52 resin described in Patent Document 2 (Japanese Unexamined Patent Publication No. 2011-236387) has improved its viscosity by using a specific solid-phase polymerization method, its poor melt retention stability will lead to polyoxamide resin in the melt processing process. The viscosity of the
For polyamide resins containing oxalic acid units, there is a problem of poor melt retention stability
[0005] Patent Document 3 (Japanese Patent Application No. 2002-527558) describes that the addition of organic halogen compounds effectively improves the heat resistance of polyamide resins, but there is no specific description of organic iodides.
In addition, Patent Document 4 (Japanese Unexamined Patent Publication No. 63-275627) records that organic halides are catalysts for the polymerization of polyamide resins, but there is no relevant record of improving the stability of melt retention.
In addition, it is described in Patent Document 5 (CN103865058A) that the addition of halogen metal compounds effectively improves the melt retention stability of polyamide resins, but the long-term melt retention stability still needs to be improved

Method used

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  • Polyamide resin, and preparation method therefor and molded product thereof
  • Polyamide resin, and preparation method therefor and molded product thereof
  • Polyamide resin, and preparation method therefor and molded product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] The three-necked flask (500ml) was first purged with nitrogen for 15 minutes, and then a certain nitrogen flow was maintained. Toluene (300 ml) and DPO (24.22 g, 0.100 mol) were added to the three-necked flask, followed by stirring and raising the temperature to 70°C. After DPO was completely dissolved in toluene at 70°C, DN5 (10.218 g, 0.100 mol) was added to the system, then the temperature was raised to 130°C, and the reaction was refluxed for 1 hour. This is followed by filtration and washing, followed by drying in a vacuum oven at 100°C for 12 hours. The relative viscosity of the obtained prepolymer was 1.63.

[0059] Feed 2.00 g of the obtained prepolymer into a glass test tube with a diameter of 19 mm, then replace it with nitrogen for 5 times, then reduce the pressure of the system to below 300 Pa, and then place it in a metal bath at 280 ° C for post-polymerization The reaction time is 0.25 hours. 2 g of the blend obtained by adding 1000 ppm 1,10-diiodod...

Embodiment 2

[0065] A polyamide resin was prepared in the same manner as in Example 1, except that the amount of 1,10 diiododecane added was 310 ppm.

Embodiment 3

[0067] A polyamide resin was prepared in the same manner as in Example 1, except that the amount of 1,10 diiododecane added was 500 ppm.

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Abstract

The present invention relates to polyamide resin that contains an non-ionic organic iodide, and has excellent long-time melting retention stability. The present invention relates to polyamide resin that contains a diamine unit and a dicarboxylic acid unit with 50-100 mol% being an oxalic acid unit, and the polyamide resin contains the non-ionic organic iodide, and with respect to the weight of the polyamide resin, the iodine content is 20-6000 ppm. The polyamide resin has excellent processability. The polyamide resin can be used in resin molded products, fiber, films and the like in automobile parts, mechanical parts and the like.

Description

technical field [0001] The present invention relates to a polyamide resin containing non-ionic organic iodide and having good long-term melt retention stability, its preparation method and its molded product. Background technique [0002] Crystalline polyamide resins represented by nylon 6 and nylon 66 are widely used as fibers for clothing, industrial materials, or general-purpose engineering plastics due to their excellent characteristics and ease of melt molding. However, another On the one hand, there are also problems such as changes in physical properties caused by water absorption, deterioration in acids, high-temperature alcohols, and hot water, and the demand for polyamide resins with better dimensional stability, chemical resistance, and heat resistance is increasing. . In the field of electrical and electronic parts, along with the development of surface mount technology (SMT), polyamide resins used in this technical field require high heat resistance, including ...

Claims

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Application Information

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IPC IPC(8): C08G69/26C08G69/28C08K5/02C08K5/3462C08L77/06
Inventor 曹晓秀范向群加藤公哉陈毕文河野俊司
Owner TORAY ADVANCED MATERIALS RES LAB CHINA
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