A positioning method for packaging and picking up chips

Abstract

The invention discloses a positioning method for packaging and picking up chips. In this positioning method, in the production and design process of the integrated circuit, the triangular unexposed area on the edge of the wafer is selected as the positioning area; Do not etch, and select the positioning point for chip positioning; in the integrated circuit testing process, avoid the triangular unexposed area, and mark good or bad chips in the chip map file, and the chips that have not been tested are marked as invalid chips ;In the process of chip packaging and picking up integrated circuit chips, the chip map is used to pick up the chip, and the positioning marks in the chip map correspond to the special positioning graphics on the physical wafer, so as to realize the one-to-one correspondence between the chip map file and the physical wafer, In this way, the problem of picking up wrong chips during the packaging process can be avoided.

Description

technical field [0001] The invention relates to an integrated circuit manufacturing process and process, and the field of integrated circuit chip packaging, especially the field of integrated circuit packaging that adopts a positioning method to pick up chips. Background technique [0002] With the rapid development of integrated circuit technology, the chip size is getting smaller and smaller, and the number of chips produced by a single wafer is increasing. At the same time, due to the increase of chip functions and the increase of packaging pins, the packaging of integrated circuit chips is becoming more and more challenging, and the cost of packaging is increasing. Therefore, how to reduce the error rate in the packaging process becomes more and more difficult. As the process becomes more and more important, the step of picking up the chip die, which is the first step in chip packaging, becomes even more important. [0003] In the existing integrated circuit chip manufa...

AI Technical Summary

Problems solved by technology

However, there is a big hidden danger in using the chip map to identify and pick up the chip, which is the problem of wrong picking. How to realize the one-to-one correspondence between the chip map file and the physical wafer without making mistakes has become the primary problem to be solved when picking up the chip from the chip map file and packaging it.

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