Silicon wafer transmission control method and system

Abstract

The invention discloses a silicon wafer transmission control method and system. The method includes the following steps that: in a processing process, the processing remaining time of a current silicon wafer in a processing chamber is computed in real time; the processing remaining time of the current silicon wafer is compared with preset wafer transfer time, wherein the preset wafer transfer time is mean time required by a manipulator to transfer silicon wafers in a wafer box to corresponding processing chambers; and if the processing remaining time of the current silicon wafer is smaller than the preset wafer transfer time, the manipulator is controlled to execute a wafer transfer action of the next silicon wafer. With the silicon wafer transmission control method and system of the invention adopted, waiting time of the silicon wafers in transfer chambers can be decreased or even eliminated, and therefore, pollution to the silicon wafers caused waiting can be avoided, and therefore, the transfer efficiency of the silicon wafers and the yield of a machine can be improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a silicon wafer transmission control method and system. Background technique [0002] In a semiconductor manufacturing plant, when performing an etching process on a silicon wafer, the silicon wafer needs to be transported between various modules of the machine according to a preset path. Usually, the transmission path of silicon wafers is: cassette (LoadPort, LP for short), atmospheric manipulator, transmission chamber (LoadLock, LL for short), vacuum manipulator, process chamber (ProcessModule, PM for short), vacuum manipulator, transmission chamber, atmosphere Manipulator, film box. [0003] In the process of silicon wafer transfer, in order to ensure that the entire process is completed with better efficiency, the control system judges that as long as there is a movable path, the robot arm will transfer the wafer. For example, while the first silicon wafer is bein...

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Problems solved by technology

[0004] In the case of a long process time, this transmission method will cause that there may be processed or unprocessed silicon wafers waiting to be transmitted in each module of the machine.

If the silicon wafer is waiting in the machine for a long time, on the one hand, the residual particles in the machine will cause some unnecessary pollution to the silicon wafer and affect the yield; on the other hand, it will also cause the transmission chamber to be occupied. During scheduling, transmission cannot be performed, which reduces transmission efficiency

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