Room-temperature curing epoxy adhesive and preparation method thereof
An epoxy adhesive, room temperature curing technology, applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., can solve the problems of inability to cure quickly, poor mechanical properties of epoxy adhesives, etc.
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[0028] The present invention also provides a preparation method of room temperature curing epoxy adhesive, including:
[0029] Mix epoxy resin and aromatic amine epoxy curing agent, stir well, then add ionic liquid, diluent, plasticizer, fiber reinforcement material and filler, stir evenly, remove air bubbles, and obtain room temperature curing epoxy adhesive .
[0030] Cast the above-mentioned adhesive on a mold and place it at room temperature to cure at 30-40°C for 5 minutes, and test its mechanical and thermal properties.
Embodiment 1
[0033] Mix 100 parts of epoxy resin E-44 and 20 parts of m-phenylenediamine, stir evenly, then add 5 parts of 1-hexyl-3-methylimidazole tetrafluoroborate, 10 parts of allyl glycidyl ether, 15 parts Parts of dioctyl phthalate, 5 parts of boron fiber, 5 parts of calcium silicate, carbon black, and aluminum hydroxide mixture (the mass ratio of calcium silicate, carbon black, and aluminum hydroxide is 3:1:2), The air bubbles are removed to prepare the adhesive, which is cast on the mold to reinforce it, and it is placed at 30-40°C to cure for 5 minutes. The specific mechanical properties are shown in Table 1.
Embodiment 2
[0035] Mix 100 parts of epoxy resin F-44 and 20 parts of metaxylylenediamine, stir evenly, then add 2 parts of 1-hexyl-3-methylimidazole hexafluorophosphate, 12 parts of 2-ethyl-hexyl glycidol Ether, 15 parts of polypropylene glycol diglycidyl ether, 8 parts of boron fiber, 8 parts of magnesium oxide, remove air bubbles to prepare adhesive, cast the adhesive on a mold to reinforce it, and place it at 30-40°C for 5 min. . The specific mechanical properties are shown in Table 1.
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