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A conductive film made of alcohol-based silver nanowire ink with conductive fillers

A technology of conductive fillers and silver nanowires, applied in inks, coatings, household appliances, etc., can solve problems such as immature performance, achieve the effects of reducing light scattering, slowing down erosion, and good coating effect

Active Publication Date: 2017-12-05
CHONGQING UNIV OF ARTS & SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But unfortunately, this silver conductive ink with conductive filler is still very little, and its performance is also very immature, such as patent CN102527621A

Method used

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  • A conductive film made of alcohol-based silver nanowire ink with conductive fillers

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Embodiment

[0033] Silver nanowires with a diameter of 30-50 nm and a length of 10-20 μm are used as conductive substances. Use Zonyl@FSO-100 as surfactant, 2-amino-2-methyl-1-propanol as dispersing and anti-settling agent, propylene glycol methyl ether as leveling agent, cyclohexanol as humectant, and 2-hexyl ethanol as Defoamer, PEDOT: PSS is conductive filler, and isopropanol is used as solvent to prepare slurry; determine the composition of the formula and calculate the amount required for each substance. Then mix the other ingredients except PEDOT:PSS well and stir for 20 minutes. Then, PEDOT:PSS was added to the stirred ink and stirred for 30 minutes. Filter with a filter membrane with a pore size of 20 μm to obtain the final ink;

[0034] PET is selected as the substrate, and acrylic resin is used as the adhesive. The acrylic resin solution was coated on PET film using a Gardco Automatic Drawdown Machine DP8301 sheet coater. Then bake it with an infrared baking lamp for 5 minut...

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Abstract

The invention discloses a conductive film made of alcohol-based silver nanowire ink with conductive fillers, which is characterized in that: the ink is composed of: silver nanowire, 0.2-1.5%; fluorocarbon surfactant, 0.005-0.05% %; small molecule dispersant, 0.1‑2%; small molecule leveling agent, 1‑3%; small molecule moisturizer, 2‑5%; small molecule defoamer, 1‑2%; conductive filler, 0.2‑1.5 %; organic alcohol solvents, 84.95‑95.495%. The film preparation process is as follows: coating a layer of adhesive solution on the substrate, drying to obtain a bonding layer; then coating the prepared ink on the bonding layer, drying to obtain a silver conductive network; finally coating a Layer protective layer, dry to get the final conductive film. The coating effect of this ink is good, simple heat treatment after coating can remove most of the additives except silver wire and conductive filler, and the film made has high conductivity and light transmittance, low haze, and is bonded to the substrate Good strength, can be widely used in touch screen and other electronic products.

Description

technical field [0001] The invention belongs to the field of conductive ink and film, in particular to a conductive film made of alcohol-based silver nanowire ink with conductive fillers. Background technique [0002] The performance of silver ink determines to what extent the film prepared by it can exert the performance of silver nanowires. The ideal state is to bring out the properties of silver nanowires 100%, and this requires the help of various additives. For example, in patents CN103008679A, CN104650653A, CN103627255A and CN104464880A, more or less additives are used to prepare inks with different properties, which have been applied in different aspects. However, these inks either have less additives, resulting in poor ink performance, or have too many additives that are difficult to remove, resulting in poor film performance. In order to obtain a film with excellent performance, it is necessary to prepare an ink with more additives but which is easy to remove. Bu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/52C08J7/04C08L67/02C08L83/04C08L69/00C08L79/08C03C17/34
Inventor 黎军军关有为刘碧桃阮海波陈善勇李璐
Owner CHONGQING UNIV OF ARTS & SCI
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