Cooling system and method for spray forming of silicon-aluminum alloy

Abstract

The invention discloses a cooling system and method for spray forming of silicon-aluminum alloy. The system is composed of a first-level deposition surface cooling system and a second-level deposition room cooling system. The deposition surface cooling system comprises a gas supplying system, gas cooling devices and spraying pipes, wherein the gas supplying system, the gas cooling devices and the spraying pipes are connected in sequence through pipelines. The deposition room cooling system comprises heat sucking devices, a cooling device, a heat conduction medium inlet distribution pipeline and a heat conduction medium outlet gathering pipeline. According to the two-level cooling method, the problem that the temperature of a deposition room and the temperature of a deposition surface are too high in the spray forming process, and consequently the solidification velocity of silicon-aluminum particles is reduced is solved, and the defects that in the prior art, the cooling efficiency is low, and the deposition surface cannot be directly cooled are overcome.

Description

technical field [0001] The invention relates to the technical field of metal alloy spray forming, in particular to a cooling system and a cooling method for efficiently cooling deposited blanks in spray forming silicon-aluminum alloys. Background technique [0002] High-silicon aluminum alloy (Si content 30-70%) has light weight, low expansion, high thermal conductivity, and certain mechanical properties. It is an electronic packaging material with excellent comprehensive performance, especially suitable for electronic packaging of aerospace electronic equipment. Due to the high silicon content, there are a large amount of coarse primary silicon and eutectic silicon in the alloy structure obtained by ordinary casting methods, resulting in a decrease in plasticity and toughness and an increase in brittleness of the material. At present, spray forming is the most ideal process for preparing high-silicon aluminum alloys. [0003] Spray forming is a rapid solidification semi-so...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method for efficiently cooling the deposition chamber and the deposition surface of the silicon-aluminum alloy spray forming process, aiming to solve the problem of reducing the silicon-aluminum particles due to the high temperature of the deposition chamber and the deposition surface during the spray forming process. The problem of solidification speed is to overcome the low cooling efficiency of the existing technology and the inability to directly cool the deposition surface

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