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Flexible displayer and production method thereof

A technology for flexible displays and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve problems such as increased film stress, poor flexibility of the inorganic film 31, and decreased flexibility of the packaging structure 30, achieving anti- Strong oxidizing properties, improved flexibility, and the effect of increasing the contact area

Active Publication Date: 2015-12-30
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The encapsulation structure 30 is a structure in which one layer of organic film 32 and multiple layers of inorganic films 31 are superimposed. The organic film 32 has good flexibility and meets the requirements for flexibility of flexible displays. However, the organic film 32 has poor oxidation resistance, so it needs to be The organic film 32 is provided with a multi-layer inorganic film 31 with strong oxidation resistance
[0004] However, the flexibility of the inorganic film 31 itself is relatively poor, and the arrangement of the multi-layer inorganic film 31 will lead to an increase in the stress between the film layers, resulting in a decrease in the flexibility of the packaging structure 30, which cannot meet the flexibility requirements of the flexible display.

Method used

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  • Flexible displayer and production method thereof
  • Flexible displayer and production method thereof
  • Flexible displayer and production method thereof

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Embodiment Construction

[0022] In order to make the purpose, features and advantages of the technical solution proposed by the present invention more obvious and understandable, the embodiments of the technical solution proposed by the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the proposed technical solution, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0023] This embodiment provides a flexible display, such as figure 2 with image 3 As shown, the flexible display includes a packaging structure 30, and the packaging structure 30 includes stacked multilayer packaging films, and the multilayer packaging film includes a multilayer inorganic film 31; at least one pair of the mult...

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Abstract

The invention provides a flexible displayer and a production method thereof, and relates to the technical field of displayers. A packaging structure of the flexible displayer can meet not only the requirement of oxidation resistance, but also the requirement of flexibility. The flexible displayer comprises the packaging structure; the packaging structure comprises a plurality of overlapped packaging films; the packaging films comprise a plurality of inorganic films; matched concave-convex structures are formed in two contact surfaces of at least one pair of adjacent packaging films; at least one of two adjacent packaging films is an inorganic film. The flexible displayer is used for picture displaying.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible display and a manufacturing method thereof. Background technique [0002] With the continuous development of display technology, flexible displays have become a research hotspot in the field of display technology. Flexible displays have the characteristic of being bendable and can produce a special user experience, and are applied in various fields such as portable electronic devices, wearable electronic devices, game devices, and display screens in shopping malls. [0003] Flexible displays are usually based on OLED (OrganicLight-EmittingDiode, organic light-emitting diode) display technology, such as figure 1 As shown, its structure mainly includes an array substrate 10, an OLED light emitting structure 20 and a packaging structure 30, wherein the OLED light emitting structure 20 includes an anode layer, a light emitting layer and a cathode layer stacked in sequenc...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
CPCH10K2102/311H10K71/00H10K59/8731H10K50/8445H10K59/12H10K59/1201
Inventor 金相秦吴代吾
Owner BOE TECH GRP CO LTD
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