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Electronic skin with irregular surface microspikes and preparation method of electronic skin

An electronic skin and irregular technology, applied in the field of sensors, can solve the problems of unsuitable large-area preparation process, high cost and manufacturing, and achieve the effect of high sensitivity, low cost and increased sensitive pressure area

Active Publication Date: 2015-12-30
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current method of preparing molds by photolithography is similar to this method. For example, the photolithography preparation process using silicon wafers as molds is obviously not suitable for large-area preparation processes due to the limitation of single crystal silicon growth technology. Traditional methods to achieve large-area electronic skin preparation will face high costs and difficulties in manufacturing

Method used

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  • Electronic skin with irregular surface microspikes and preparation method of electronic skin
  • Electronic skin with irregular surface microspikes and preparation method of electronic skin
  • Electronic skin with irregular surface microspikes and preparation method of electronic skin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Example 1: Preparation of electronic skin based on #180 sandpaper.

[0043] Concrete preparation is carried out as follows:

[0044] 1. Use #180 sandpaper as a template, first clean the surface of the sandpaper with oxygen-plasma and then treat it with the release agent perfluorooctyltrichlorosilane;

[0045] 2. Then, mix the PDMS (polydimethylsiloxane) monomer and the crosslinking agent uniformly according to the mass ratio of 10:1 to obtain a PDMS mixed solution, which is used to prepare the support layer;

[0046] 3. After vacuumizing the PDMS mixed solution to remove air bubbles, prepare a wet film on the surface of the treated sandpaper by using the rotary homogenization method at a speed of 500 rpm;

[0047] 4. Heat at 100°C for 30 minutes to solidify the wet film, and prepare a highly irregular PDMS support layer 3 with a thickness of about 150 μm; the surface of the support layer prepared with #180 sandpaper has an average height of 80 μm and an average diamete...

Embodiment 2

[0052] Example 2: Preparation of electronic skin based on #240 sandpaper.

[0053] Concrete preparation is carried out as follows:

[0054] 1. Use #240 sandpaper as a template, first clean the surface of the sandpaper with oxygen-plasma, and then use the release agent perfluorooctyltrichlorosilane for vacuum evaporation treatment;

[0055] 2. Then mix the PDMS monomer and crosslinking agent evenly according to the mass ratio of 10:1;

[0056] 3. After vacuumizing the PDMS mixed solution to remove air bubbles, prepare a wet film on the surface of the treated sandpaper by using the rotary homogenization method at a speed of 700 rpm;

[0057] 4. Heating at 100°C for 30 minutes to solidify the wet film, and prepare a highly irregular PDMS support layer 3 with a thickness of about 120 μm;

[0058] 5. After demoulding the PDMS, treat the undulating surface with oxygen plasma to make the surface hydrophilic;

[0059] 6. Prepare a wet film of PEDOT:PSS on the surface of the treated...

Embodiment 3

[0063] Example 3: Preparation of electronic skin based on #600 sandpaper.

[0064] Concrete preparation is carried out as follows:

[0065] 1. Use #600 sandpaper as a template, first clean the surface of the sandpaper with oxygen-plasma, and then use the release agent perfluorododecyltrichlorosilane for vacuum evaporation treatment;

[0066] 2. Then mix the PDMS monomer and crosslinking agent evenly according to the mass ratio of 10:1;

[0067]3. After vacuumizing the PDMS mixed solution to remove air bubbles, prepare a wet film on the surface of the treated sandpaper by using the rotary homogenization method at a speed of 2000 rpm;

[0068] 4. Heating at 100° C. for 30 minutes to solidify the wet film, and prepare a PDMS support layer 3 with a thickness of about 60 μm;

[0069] 5. After demoulding the PDMS, treat the undulating surface with oxygen plasma to make the surface hydrophilic;

[0070] 6. Prepare a wet film of PEDOT:PSS (CleviosPH1000) on the surface of the treat...

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Abstract

The invention discloses electronic skin with irregular surface microspikes. The electronic skin comprises a substrate, a support layer, a pressure-sensitive sensing layer, an electrode layers and a flexible protective layer in sequence from bottom to top, wherein the edge of the flexible protective layer is bonded with the substrate through a double-side viscous layer, so as to package the support layer, the pressure-sensitive sensing layer and the electrode layer; the microspikes are formed on the surfaces of both the support layer and the pressure-sensitive sensing layer. The electronic skin is obtained by treating a material with non-uniform surface microscopic height as a mold plate according to a chemical solution method. The electronic skin has the characteristics of double sensitivity; the sensitivity in a low-pressure area reaches up to 909 kPa<-1>; the sensitivity in a high-pressure area reaches up to 46 kPa<-1>; the total sensitivity in the pressure sensitive area can reach up to 20 kPa or higher. The electronic skin and a preparation method thereof have the advantages of being novel and simple, obvious in effect, excellent in performance and low in cost, thereby having huge potential and superiority in the field of robots.

Description

technical field [0001] The invention belongs to the field of sensors, and relates to an electronic skin and a preparation method thereof, in particular to a pressure-sensitive electronic skin with irregular surface micro-protrusions, that is, micro-protrusions with random distribution of micro-protrusion height and particle size, and a preparation method thereof. Background technique [0002] In recent years, people's living standards have continued to improve and the speed of social development has become faster and faster. The requirements for the quality of life have also become higher and higher, and they are gradually developing towards intelligent automation, such as robot sweepers and vacuum cleaners that appear on the market. In the industrial world, robots can complete the work that humans can do under unbearable environments and loads, and achieve motion accuracy that humans cannot achieve, and they have also been widely used. However, how can robots more effective...

Claims

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Application Information

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IPC IPC(8): G01L5/00
Inventor 王宗荣杜丕一月扬宇徐乾坤马宁韩高荣翁文剑
Owner ZHEJIANG UNIV
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