Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Double-sided aluminum-based copper-clad plate for LED lamp and manufacturing method for double-sided aluminum-based copper-clad plate

A technology of aluminum-based copper-clad laminates and LED lamps, which is applied in chemical instruments and methods, lamination, lighting and heating equipment, etc., can solve the problems of increasing the cost of aluminum substrates and complicated processes, so as to avoid parasitic capacitance, simple insulation treatment, Improve the effect of anti-jamming function

Active Publication Date: 2015-12-09
浙江德加电子科技有限公司
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned technical solution improves the prior art to a certain extent, and in particular proposes a method for making vias on aluminum substrates. The cost of the aluminum substrate is reduced, so its application in the field of low-cost LED lamps has certain limitations

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Double-sided aluminum-based copper-clad plate for LED lamp and manufacturing method for double-sided aluminum-based copper-clad plate
  • Double-sided aluminum-based copper-clad plate for LED lamp and manufacturing method for double-sided aluminum-based copper-clad plate
  • Double-sided aluminum-based copper-clad plate for LED lamp and manufacturing method for double-sided aluminum-based copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.

[0041]In the multilayer circuit board in the prior art, the circuit layer of the middle layer needs to be connected with its upper and lower layer circuits or external circuits, usually by processing metal vias on the circuit board. However, in the double-sided aluminum substrate, since the aluminum base layer in the middle is made of metal material, it is necessary to perform insulation treatment before making the metal via hole during the via hole processing, and the preparation process is very complicated; parasitic capacitance. In the circuit board used in the field of LED lamps, with the miniaturization of devices and the continuous maturity of SMT technology, both the light strip circuit and the more complex drive ci...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a double-sided aluminum-based copper-clad plate for an LED lamp and a manufacturing method for the double-sided aluminum-based copper-clad plate. The copper-clad plate comprises an aluminum base layer, a first insulating layer and a second insulating layer which are separately arranged on two sides of the aluminum base layer, a first copper foil layer which is arranged on the first insulating layer and is far from one side of the aluminum base layer, and a second copper foil layer which is arranged on the second insulating layer and is far from one side of the aluminum base layer, wherein circuit maps are formed on the first copper foil layer and the second copper foil layer; a plurality of exposed arc-shaped connecting via holes are formed at the circumferential side of the copper-clad plate, and after a third insulating layer is arranged on the inner walls of the connecting via holes, copper is plated on the insulating inner walls for being electrically connected with the first copper foil layer and the second copper foil layer. By adopting the technical scheme provided by the invention, the via holes for electrically connecting upper and lower circuits are formed at the circumferential side of the copper-clad plate and are exposed outside, so that the via holes of an aluminium base plate are prepared without adopting a complex process, and meanwhile, generation of stray capacitance is avoided, thereby further enhancing the anti-interference function of a circuit board.

Description

technical field [0001] The invention relates to the technical field of LED circuit boards, in particular to a double-sided aluminum-based copper-clad laminate for LED lamps and a manufacturing method thereof. Background technique [0002] Aluminum-based copper-clad laminate is one of the key components of LED lamps. In the prior art, there are generally two circuit boards in LED lamps, one is the aluminum-based copper-clad laminate for loading the LED wick, and the other is for driving the LED wick. Drive board, with the continuous development of LED lamps in the direction of high performance and small size, especially in areas with limited internal space such as downlights, two circuit boards are installed inside the lamp to make the inside of the lamp very crowded, which is not conducive to the heat dissipation of the lamp, and Higher requirements are put forward for the design and installation of circuit boards. Double-sided aluminum substrates are used in LED lamps, tha...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/092B32B15/20B32B27/18B32B3/24B32B38/00B32B37/10B32B38/14B32B37/06F21S2/00
CPCB32B3/266B32B7/12B32B15/092B32B15/20B32B27/06B32B27/18B32B27/38B32B33/00B32B37/02B32B37/06B32B37/10B32B38/00B32B38/145F21S2/00
Inventor 黄骇
Owner 浙江德加电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com