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Copper/silver core-shell nanoparticles low-temperature sintering composite solder paste and preparation method thereof

A technology of copper nanoparticles and nanoparticles, which is applied in the field of material processing, can solve problems such as easy oxidation and electromigration, and achieve the effects of reducing sintering energy, solving easy oxidation, and increasing thermal stability temperature

Active Publication Date: 2017-03-08
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem of electromigration and ion migration in the service process of high-cost nano silver solder paste and the problem of easy oxidation in the preparation, storage and bonding process of nano copper solder paste, the present invention provides a " and "multi-level assembly" low-cost copper / silver core-shell nanoparticle low-temperature sintering composite solder paste and its preparation method, using the size effect of nanomaterials to greatly reduce its connection temperature, thereby avoiding damage to devices and substrates during sintering heat damage

Method used

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  • Copper/silver core-shell nanoparticles low-temperature sintering composite solder paste and preparation method thereof
  • Copper/silver core-shell nanoparticles low-temperature sintering composite solder paste and preparation method thereof
  • Copper/silver core-shell nanoparticles low-temperature sintering composite solder paste and preparation method thereof

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specific Embodiment approach 1

[0030] Specific implementation mode 1: In this implementation mode, copper / silver core-shell nanoparticle low-temperature sintering composite solder paste is prepared according to the following steps:

[0031] Step 1: If figure 1 As indicated, add 1 g of K90 polyvinylpyrrolidone into a conical flask containing 100 ml of polyethylene glycol, heat to 160 °C and stir until the polyvinylpyrrolidone is completely dissolved in the polyethylene glycol middle;

[0032] Step 2: Add 0.5 g of sodium hydrogen hypophosphite into the above solution and stir until completely dissolved;

[0033] Step 3: Add 1.5 g of copper sulfate to 20 ml of aqueous solution and stir to completely dissolve it;

[0034] Step 4: Add the copper sulfate aqueous solution dropwise to the polyethylene glycol solution containing polyvinyl pyrrolidone and sodium hydrogen hypophosphite, while stirring, the color of the solution gradually changes from colorless to yellow, orange, gray, black, and Finally stabilized ...

specific Embodiment approach 2

[0045] Specific implementation mode 2: In this implementation mode, copper / silver core-shell nanoparticle low-temperature sintering composite solder paste is prepared according to the following steps:

[0046] Step 1: Add 1 g of K90 polyvinylpyrrolidone into a conical flask containing 100 ml of polyethylene glycol, heat to 190 °C and stir until the polyvinylpyrrolidone is completely dissolved in the polyethylene glycol middle;

[0047] Step 2: Add 0.5 g of sodium hydrogen hypophosphite into the above solution and stir until completely dissolved;

[0048] Step 3: Add 1.5 g of copper sulfate to 20 ml of aqueous solution and stir to completely dissolve it;

[0049] Step 4: Add the copper sulfate aqueous solution dropwise to the polyethylene glycol solution containing polyvinyl pyrrolidone and sodium hydrogen hypophosphite, while stirring, the color of the solution gradually changes from colorless to yellow, orange, gray, black, and Finally stabilized in purple;

[0050] Step 5...

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Abstract

The invention discloses copper / silver core-shell nano particle low-temperature sintering composite welding paste and a preparation method thereof. The welding paste is prepared from copper / silver core-shell nano particles, a dispersant and a surfactant in a mass ratio of (80-85) to (2-5) to (10-18). According to the welding paste, by adopting copper / silver core-shell nano particles for replacing silver nano welding paste and copper nano welding paste, the problems that the silver nano welding paste is high in cost, and has electric migration and ion migration and the like are solved, and the problem that the copper nano welding paste is easy to oxidize is solved, so that a low-cost connection material used for mutually connecting electronic packaging devices is obtained. In a sintering process of the nano particles, a nano grade is reduced by a connection region, the needed sintering energy is greatly reduced, the sintering temperature is greatly lower than a melting point of a block material, and the thermal stable temperature of sintered tissues is improved, so that the requirements of low-temperature connection, high-temperature service and multileveled assembling are met, and the welding paste can be widely applied to LEDs, power assemblies and high-frequency devices.

Description

technical field [0001] The invention belongs to the field of material processing, and relates to a low-temperature sintered copper-silver composite nano-solder paste and a preparation method thereof, in particular to a copper-silver composite nano-solder paste which can be used as an interconnect material in electronic device packaging and assembly and a preparation method thereof . Background technique [0002] In recent decades, the development direction of devices is miniaturization, portability and multi-function, and their packaging density and size are gradually reduced. However, when Si-based devices are reduced to a certain size, the leakage current introduced will greatly increase the cost of electronic devices in terms of packaging and maintenance work. In addition, the limit service temperature of Si-based devices is 150°C, which cannot work under high temperature and high power. As a third-generation semiconductor, SiC can reduce the chip size by 18-20 times at...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/14
CPCB23K35/0244B23K35/025
Inventor 田艳红江智文嘉玥
Owner HARBIN INST OF TECH
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