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High thermal conductive paste

A technology of high thermal conductivity and thermal conductivity powder is applied in the field of high thermal conductivity paste, which can solve the problems of inability to screen printing and low heat dissipation coefficient, and achieve the effect of improving thermal conductivity, high thermal conductivity and high thermal conductivity.

Inactive Publication Date: 2015-11-25
HUIZHOU KECHENGTONG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermal paste is widely used in the heat conduction of low-space heat-generating materials, such as high-power LED chips, electronic components, etc.; the current thermal paste products on the market mainly have the following defects: 1. The heat dissipation coefficient is low, only 1.0; 2. It cannot be screen printed print

Method used

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Embodiment 1

[0033] High thermal conductivity paste of the present invention comprises the following components by weight percentage:

[0034] 20% silicone oil, 60% composite thermal conductive powder, 2% coupling agent, 3% dispersant, 1% leveling agent.

Embodiment 2

[0036] High thermal conductivity paste of the present invention comprises the following components by weight percentage:

[0037] Silicone oil 30%, composite thermal powder 70%, coupling agent 5%, dispersant 7%, leveling agent 3%.

Embodiment 3

[0039] The high heat conduction paste of the present invention comprises the following components by weight percentage: 25% of silicone oil, 65% of composite heat conduction powder, 5% of coupling agent, 5% of dispersant, and 1.5% of leveling agent.

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Abstract

The invention relates to the field of thermal conductive materials, and particularly discloses high thermal conductive paste. The high thermal conductive paste comprises, by weight, 20%-30% of silicone oil, 60%-70% of composite thermal conductive powder, 2%-5% of a coupling agent, 3%-7% of a dispersing agent and 1%-3% of a flatting agent. The invention further discloses a preparation method for preparing the high thermal conductive paste. The thermal conductive paste is high in thermal conductive coefficient, can be used on various components for thermal conduction and can be used for silk-screen printing.

Description

technical field [0001] The invention relates to the field of thermally conductive materials, in particular to a high thermally conductive paste. Background technique [0002] In order to solve the heat dissipation problem of electronic components, heat dissipation devices or heat dissipation materials are usually installed on the surface of electronic components. Thermal paste is widely used in the heat conduction of low-space heat-generating materials, such as high-power LED chips, electronic components, etc.; the current thermal paste products on the market mainly have the following defects: 1. The heat dissipation coefficient is low, only 1.0; 2. It cannot be screen printed print. Therefore, it is the problem to be solved by the present invention to research and develop a thermally conductive paste with high thermal conductivity. Contents of the invention [0003] The object of the present invention is to provide a thermally conductive paste with high thermal conducti...

Claims

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Application Information

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IPC IPC(8): C09K5/08
Inventor 张金汉
Owner HUIZHOU KECHENGTONG TECH CO LTD
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