Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sliver alloy bonding wire for LED packaging, and manufacturing method thereof

A technology of LED packaging and silver alloy bonding, which is applied in the field of bonding wire, can solve the problems of insufficient packaging reliability, less residual gold, and insufficient bonding surface, etc., and achieve improved wire drawing ability, improved mechanical properties, and high packaging reliability. performance effect

Active Publication Date: 2015-11-18
NICHE TECH KAISER SHANTOU
View PDF6 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Existing silver alloy wires are used in LED packaging, and the bonding surface formed between the ball bonding surface and the surface of the pad (Pad) is not large enough, the amount of residual gold is small, and the packaging reliability is not high enough.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sliver alloy bonding wire for LED packaging, and manufacturing method thereof
  • Sliver alloy bonding wire for LED packaging, and manufacturing method thereof
  • Sliver alloy bonding wire for LED packaging, and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The silver alloy bonding wire for LED packaging in this embodiment contains by weight: 2% palladium, 2ppm gold, 1ppm platinum, 8ppm calcium, 1.6ppm magnesium, 5ppm iron, and the balance is silver.

[0035] In this embodiment, the manufacturing method of the silver alloy bonding wire for LED packaging comprises the following steps:

[0036] (1) Melting and casting: adding palladium, gold, platinum, calcium, magnesium and iron to the silver raw material according to the above ratio, and through pre-alloying, master alloying and directional continuous drawing process, a wire rod with a diameter of 8 mm (millimeters) is obtained;

[0037] Above-mentioned silver raw material adopts the silver that purity is 99.99%;

[0038] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy bonding wire with a diameter of 25um (micrometer);

[0039] During the wire drawing process, an intermediate annealing is carried out on the wire. The intermediate annea...

Embodiment 2

[0045] The silver alloy bonding wire for LED packaging in this embodiment contains by weight: 2.8% palladium, 2.6ppm gold, 2ppm platinum, 9ppm calcium, 1.8ppm magnesium, 6ppm iron, and the balance is silver.

[0046] In this embodiment, the manufacturing method of the silver alloy bonding wire for LED packaging comprises the following steps:

[0047] (1) Melting and casting: add palladium, gold, platinum, calcium, magnesium and iron to the silver raw material in the above ratio, and obtain a wire rod with a diameter of 7mm (millimeters) through pre-alloying, master alloying and directional continuous drawing process;

[0048] Above-mentioned silver raw material adopts the silver that purity is 99.99%;

[0049] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy bonding wire with a diameter of 50um (micrometer);

[0050] During the wire drawing process, an intermediate annealing is carried out on the wire. The intermediate annealing is carried ...

Embodiment 3

[0056] The silver alloy bonding wire for LED packaging in this embodiment contains by weight: 3.5% palladium, 3.2ppm gold, 3ppm platinum, 10ppm calcium, 2ppm magnesium, 7ppm iron, and the balance is silver.

[0057] In this embodiment, the manufacturing method of the silver alloy bonding wire for LED packaging comprises the following steps:

[0058] (1) Melting and casting: add palladium, gold, platinum, calcium, magnesium and iron to the silver raw material according to the above ratio, and obtain a wire rod with a diameter of 6mm (millimeters) through pre-alloying, master alloying and directional continuous drawing process;

[0059] Above-mentioned silver raw material adopts the silver that purity is 99.99%;

[0060] (2) Wire drawing: drawing the wire obtained in step (1) to obtain a silver alloy bonding wire with a diameter of 18um (micrometer);

[0061] During the wire drawing process, an intermediate annealing is carried out on the wire. The intermediate annealing is car...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Diameteraaaaaaaaaa
Diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to a sliver alloy bonding wire for LED packaging, wherein the sliver alloy bonding wire is characterized by comprising by weight: 2-3.5% of a first additive, 10-30 ppm of a second additive, and the balance of sliver, wherein the first additive is palladium, and the second additive is one or a combination comprising a plurality of materials selected from gold, platinum, calcium, magnesium and iron. The present invention further provides a manufacturing method of the sliver alloy bonding wire for LED packaging. The manufacturing method comprises: (1) casting to obtain a wire material; (2) drawing, wherein the wire material is drawn to obtain a silver alloy bonding wire with a diameter of 18-50 [mu]m, and intermediate annealing is performed on the wire material during the drawing process when the drawing diameter is 0.9100-0.0384 mm; and (3) finally annealing, wherein the sliver alloy bonding wire is subjected to final annealing after completing the drawing, and cooling is performed to obtain the sliver alloy bonding wire for LED packaging. According to the present invention, the sliver alloy bonding wire is used for LED packaging, the bonding degree between the FAB and LED bonding pad can be enhanced during the ball bonding can be enhanced, the residual gold is more, and the reliability of the LED packaging product is improved.

Description

technical field [0001] The invention relates to a bonding wire for LED packaging, in particular to a silver alloy bonding wire for LED packaging and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting chips to external packaging substrates (substrates) and / or multilayer circuit boards (PCBs). The development trend of bonding wire, from the application direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; from the chemical composition, there are mainly copper wires (including bare copper wires, palladium-plated copper wires, Flash gold palladium-plated copper wire) has largely replaced gold wire in the semiconductor field, while silver wire and silver alloy wire have replaced gold wire in LED and some IC packaging applications. [0003] The large number of silver alloy wires used in the LED industry is mainly based on the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C22C5/06C22F1/14H01L23/49H01L21/48
CPCH01L2224/45139H01L24/43H01L24/45H01L2924/00011H01L2924/01046H01L2924/01079H01L2924/01078H01L2924/0102H01L2924/01012H01L2924/01026H01L2924/01049
Inventor 周振基周博轩任智
Owner NICHE TECH KAISER SHANTOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com