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A kind of hole-filling electroplating leveling agent, preparation method and electroplating solution using the leveling agent

A technology of electroplating solution and leveling agent, which is applied in the field of electroplating solution, hole filling electroplating leveling agent and its preparation, to achieve the effect of improving interaction and excellent hole filling performance

Active Publication Date: 2017-09-12
SHENZHEN BANMING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the continuous development and progress of information technology, the design of high-density interconnection (HDI) is developing in the direction of more blind holes, smaller hole diameters, and higher aspect ratios of some blind holes. Related processes such as interconnect micro-blind via plating bring great challenges

Method used

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  • A kind of hole-filling electroplating leveling agent, preparation method and electroplating solution using the leveling agent
  • A kind of hole-filling electroplating leveling agent, preparation method and electroplating solution using the leveling agent
  • A kind of hole-filling electroplating leveling agent, preparation method and electroplating solution using the leveling agent

Examples

Experimental program
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Effect test

Embodiment 1

[0046] Take a 1L double-neck round bottom flask, equipped with a cold flow reflux tube and a dropping funnel, and add 300mL of deionized water into the flask. At room temperature, 0.5mol of 3-(dimethylamino)-1-propanethiol and 0.5mol of piperazine were successively dissolved in the reaction system, and stirred at room temperature for 10 minutes; (3.3) Add dropwise to the reaction system in the flask from the dropping funnel, and then raise the temperature of the reaction system to 60°C for polymerization; react for 24 hours and cool to room temperature to obtain a yellow viscous solution, which is the hole-filling electroplating leveler.

Embodiment 2

[0048]Take a 1L double-neck round bottom flask, equipped with a cold flow reflux tube and a dropping funnel, and add 300mL of deionized water into the flask. At room temperature, 0.5mol of 3-(dimethylamino)-1-propanethiol and 0.5mol of piperazine were successively dissolved in the reaction system, and stirred at room temperature for 10 minutes; (3.6) Add dropwise to the reaction system in the flask from the dropping funnel, and then raise the temperature of the reaction system to 80°C for polymerization; after 24 hours of reaction, cool to room temperature to obtain a yellow viscous solution, which is the hole-filling electroplating leveler.

Embodiment 3

[0050] Take a 1L double-neck round bottom flask, equipped with a cold flow reflux tube and a dropping funnel, and add 300mL of deionized water into the flask. At room temperature, 0.3mol of 3-(dimethylamino)-1-propanethiol and 0.4mol of piperazine were successively dissolved in the reaction system, and stirred at room temperature for 15 minutes; Compound (3.1) was added dropwise into the reaction system in the flask from the dropping funnel, and then the reaction system was heated to 70°C for polymerization; after 24 hours of reaction, it was cooled to room temperature to obtain a yellow viscous solution, which was the hole-filling electroplating leveler.

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Abstract

The invention discloses a hole-filling electroplating leveling agent, a preparation method thereof and an electroplating solution using the hole-filling electroplating leveling agent, and relates to the technical field of electroplating. The hole-filling electroplating leveling agent includes ingredients 3-(dimethylamino)-1-propanethiol, piperazine, binary epoxy compound, and the 3-(dimethylamino)-1-propanethiol The molar mass ratio of mercaptan, piperazine and binary epoxy compound is 1~3:2~4:4~6; described binary epoxy compound has the following structural formula: wherein, R is the connection of non-epoxy group group. The hole-filling electroplating leveling agent of the present invention improves the interaction between the leveling agent molecule and the accelerator and inhibitor by introducing a sulfur atom-containing functional group into the leveling agent molecule, so that the three types of additives can better cooperate with each other , so that the prepared electroplating solution can achieve excellent hole filling performance.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a hole-filling electroplating leveling agent, a preparation method thereof and an electroplating solution using the hole-filling electroplating leveling agent. Background technique [0002] In recent years, consumer electronic products have become thinner, more integrated, and more multifunctional, requiring printed circuit boards (PCBs) to have the characteristics of high density, high precision, and high reliability, so that they can load more on a limited surface. micro devices. Blind via metallization is an effective means to realize electrical interconnection between layers of Printed Circuit Board (PCB), and it is also one of the key technologies for the development of High Density Interconnection (HDI) boards. HDI is mainly manufactured using the technology of micro-blind holes, which can greatly increase the density and flexibility of wiring on the PCB compared wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D7/04
Inventor 罗继业陈威丁杰郝意黄志齐
Owner SHENZHEN BANMING SCI & TECH CO LTD
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