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LGA welding process method in printed circuit board processing

A soldering process and printed board technology, applied in printed circuit manufacturing, printed circuit, printed circuit, etc., to achieve stable output power, small ripples, and reduce the effects of tin-less loopholes

Active Publication Date: 2015-10-28
无锡市同步电子制造有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides an LGA welding process in the processing of printed boards, which can solve the quality problem of small batches of LGA welding in PCBA production and processing, and can also solve the requirement of one-time pass-through rate in mass production, and can reduce tin-less loopholes and greatly Product quality problems such as voids and solder joints, reduce repairs, thereby saving costs and improving customer satisfaction

Method used

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  • LGA welding process method in printed circuit board processing
  • LGA welding process method in printed circuit board processing
  • LGA welding process method in printed circuit board processing

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Embodiment Construction

[0040] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0041] Process flow of the present invention such as figure 1 Shown:

[0042] (1) Design and production of pre-treatment molds: making fixed fixtures and small bushings: According to the shape and size of the LGA and the conditions of the bottom terminals, the fixed fixtures and small bushings are prefabricated.

[0043] This step belongs to the pretreatment process before LGA welding. The fixed jig and small bushing are special jigs and steel sheet molds for pre-treatment of printing solder paste. The function of using the fixed jig and small bushing is It can improve the subsequent LGA welding effect.

[0044] figure 2 is the graphic of the fixed fixture. The main body of the fixing jig is a flat steel plate with a thickness equal to that of the LGA to be fixed, and one or more notches consistent with the shape of the LGA to be fixed ...

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Abstract

The invention provides an LGA welding process method in printed circuit board processing. The method comprises the steps that a fixing jig used for LGA printing and a small leakage plate are produced; baking and dehumidifying are carried out on LGA; the fixing jig used for LGA printing and the small leakage plate are used to print solder paste on the LGA; a reflow oven is used to carry out reflowing on the solder paste on the LGA; a full-automatic printing press is used to print the solder paste on a printed circuit board; a chip mounter is used to carry out surface mounting on the LGA; reflowing soldering is carried out on the LGA; and X-RAY detection is carried out. According to the invention, the requirement of once first pass yield of batch production can be met; product quality problems of insufficient solder leaks, large holes, continuous solder and the like are reduced; rework is reduced; the cost is saved; the use of the LGA reaches a new and high field; and the LGA welding process method has a high market value and a large application prospect.

Description

technical field [0001] The invention relates to a printed board processing technology, in particular to an LGA welding technology in the printed board processing. Background technique [0002] In printed circuit boards (PCBA) used in domestic and foreign military and aerospace industries, LGA has been widely used as a stable power output chip. Due to its small size and small ripple power output, LGA is easier to design and control than other integrated power supplies and discrete power supplies. However, due to the special form of LGA packaging, it has always been a technical difficulty for Denso to obtain good quality and reliability. At present, domestic Denso LGA devices are mainly used for ordinary soldering that is printed with solder paste on the printed board and then mounted and reflowed. This type of soldering method will cause various product quality problems such as less tin, large voids and tin connection, resulting in the inability to realize the LGA function a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/341H05K2201/10719H05K2203/043
Inventor 应朝晖潘一峰林利剑石守国张海星胡雨佳
Owner 无锡市同步电子制造有限公司
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