Diffusion entry-exit furnace automatic push-and-pull boat system apparatus

Abstract

The invention relates to a diffusion entry-exit furnace automatic push-and-pull boat system apparatus. The apparatus comprises a diffusion furnace, a sliding seat, a speed regulation motor, a slide block, a screw rod, a mechanical arm, a push-pull rod and a manipulator. One side of the diffusion furnace is provided with the sliding seat. The slide block is arranged inside the sliding seat. The screw rod is arranged inside the slide block. One end of the screw rod is provided with the speed regulation motor. The push-pull rod is arranged on the outer side of the sliding seat. One end of the push-pull rod is connected with the upper end of the slide block through a round pin while the other end passes through a guide wheel support and is connected with the mechanical arm. The lower end of the mechanical arm is connected with the manipulator. A first stop induction optocoupler is arranged on the sliding seat upper end left side. A second stop induction optocoupler is arranged on the sliding seat upper end right side. A deceleration induction optocoupler is arranged on a part located on the right side of the first stop induction optocoupler and 10 cm away from the first stop induction optocoupler. An induction block is arranged on the push-pull rod right end upper surface. The apparatus is simple and convenient. By means of the apparatus, objects are controlled to enter the diffusion furnace in a uniform speed. A relatively low internal and external temperature difference is guaranteed during processes of objects entering and exiting the furnaces. The thermal stress is reduced. Fewer silicon chip fragments are generated after diffusion. Meanwhile, good junction face linearity is achieved. Good junction depth consistency is further realized.

Description

technical field [0001] The invention relates to the technical field of automatic positioning of wafers in and out of a diffusion furnace, in particular to an automatic push-pull boat system device for diffusion in and out of a furnace. Background technique [0002] The wafer coated with impurity sources cannot form the PN junction required by semiconductor devices at room temperature, and must be placed in a diffusion furnace for diffusion at high temperature. The wafer is manually sent to the constant temperature zone of the diffusion furnace with a quartz hook. The moving speed of the wafer is not uniform, and the silicon wafer is prone to deformation, resulting in many fragments in the process of stripping the silicon wafer after diffusion. Uniform. Contents of the invention [0003] In order to solve the above problems, the present invention proposes an automatic push-pull boat system device for diffusion in and out of the furnace, which is simple in design and easy t...

AI Technical Summary

Problems solved by technology

The wafer is manually sent to the constant temperature zone of the diffusion furnace with a quartz hook. The moving speed of the wafer is not uniform, and the silicon wafer is prone to deformation, resulting in many fragments in the process of stripping the silicon wafer after diffusion. Uniform

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