Shielding film, shielding circuit board and terminal device

Abstract

The present invention relates to the technical field of electromagnetic shielding. Disclosed in an embodiment of the present invention are a shielding film, shielding circuit board and terminal device, being capable of improving the electromagnetic shielding effect, decreasing product thickness and improving heat dissipation performance. The shielding film comprises a first insulating layer and a shielding layer located over the first insulating layer, the first insulating layer being of flexible insulative material or anisotropic conductive material, and the shielding layer being of electrically conductive or magnetically conductive material.

Description

technical field [0001] The invention relates to the technical field of electromagnetic shielding, in particular to a shielding film, a shielding circuit board and terminal equipment. Background technique [0002] Electromagnetic shielding technology refers to the use of shields made of magnetic or conductive materials to limit electromagnetic interference energy within a certain range to control the induction or radiation of electric fields, magnetic fields, and electromagnetic waves from one area to another. Specifically, shielding is used to isolate electronic components, circuit cables, or the interference source of the entire system to prevent the influence of external electromagnetic fields or the outward diffusion of interference electromagnetic fields. At present, the electronic components in electronic devices usually need to be installed on the circuit board to form a fixed circuit, so as to meet the needs of mass production and optimized layout. When electromagneti...

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Problems solved by technology

[0003] The metal shielding cover in the prior art has the following defects: firstly, when using a crimping method to connect to the grounding pad, the metal shielding cover contacts the grounding pad with a relatively large area, so as to facilitate the connection with connectors such as screws. It will cause the size of the metal shield and the grounding pad to be too large, which is not conducive to the high-density installation of electronic components on the circuit board to achieve thinning of electronic products; when connecting to the grounding pad by welding, in order to ensure high flatness , it is necessary to set several pins spaced apart from each other at the lower end of the metal shield, and solder them to the ground pad through the pins. When using the soldering method, it is necessary to reserve enough space for the solder, which will also cause the metal shield And the size of the grounding pad is too large, which is not conducive to the high-density installation of electronic components. There are gaps between the pins, which may easily cause electromagnetic leakage and reduce the effect of electromagnetic shielding

Secondly, since the metal shield is not insulated, in order to prevent the metal shield from short-circuiting the electronic components, a certain distance is usually kept between the metal shield and the electronic component, which increases the overall thickness of the circuit board after the shield is installed. In this way, it is difficult to adapt to the ultra-thin design requirements of end products

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