Method for preparing Zr/Al reaction laminated foil through EBPVD
A technology of reactive lamination and lamination, applied in coating, metal material coating process, ion implantation plating, etc., can solve the problems of Zr/Al layer interface is easy to introduce impurities, unfavorable self-propagation rate, low production efficiency, etc. , to achieve the effect of complete and clear interface, low cost and high production efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment approach 1
[0030] Embodiment 1: This embodiment is a method for preparing Zr / Al reaction laminated foil by EBPVD according to the following steps:
[0031] 1. Preliminary preparations for EBPVD: clean the ingots I and II, clean the vacuum chamber of the EBPVD equipment, and install the substrate. There are two electron guns in the vacuum chamber of the EBPVD equipment, which are electron guns I and II. The ingot I is placed under the electron gun I, the cleaned ingot II is placed under the electron gun II, the separation layer material is placed between the ingot I and the ingot II, the substrate is wiped, and the baffle is closed; The ingot I is pure Zr, and the ingot II is pure Al;
[0032]2. Preheating the ingot: close the vacuum chamber and evacuate until the vacuum degree is 6×10 -3 At Pa, turn on the electron gun Ⅰ and electron gun Ⅱ, set the current of the electron gun Ⅰ to 0.02A~0.1A, and the current of the electron gun Ⅱ to 0.02A~0.1A, use the electron gun Ⅰ to scan the ingot Ⅰ...
specific Embodiment approach 2
[0039] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the material of the separation layer in step 1 is sodium chloride or calcium chloride. Other steps are the same as in the first embodiment.
specific Embodiment approach 3
[0040] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the substrate described in Step 1 is a large heat sink integral substrate, a circulating water-cooled substrate, a static water-cooled substrate, a segmented substrate, The base plate of the radiation tube or the base plate of the water cooling box, and the thickness of the base plate is greater than 40mm. Other steps are the same as those in Embodiment 1 or 2.
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com