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Preparation methods and application of low mole ratio UF resin adhesive and high mole ratio MUF resin adhesive

A manufacturing method and high molar ratio technology, applied in the directions of adhesives, applications, manufacturing tools, etc., can solve the problems of difficult to control the production process stably, the increase in the amount of glue applied to the board, and the decline in the production capacity of the production line. The effect of improving performance and reducing overall cost

Active Publication Date: 2015-09-30
DARE TECH GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, due to the decline in the transfer strength of urea-formaldehyde resin with ultra-low free formaldehyde content, the amount of sizing on the board is lower than that of E 1 / E 0 It will increase significantly, which will significantly increase the cost of the plate; further, the production capacity of the production line will be severely reduced, and the production process will be difficult to control stably
The physical and mechanical properties of the board, such as the internal bonding strength, especially the formaldehyde emission of the board, are difficult to control stably

Method used

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  • Preparation methods and application of low mole ratio UF resin adhesive and high mole ratio MUF resin adhesive

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Embodiment Construction

[0040] The present invention will be described in detail below in conjunction with the examples, so that those skilled in the art can better understand the present invention, but the present invention is not limited to the following examples.

[0041] Manufacture of low molar ratio UF resin adhesive:

[0042] Feeding amount:

[0043] 1. Formaldehyde: 7400kg (48%)

[0044] 2. Urea: U1=3200kg, U2=1600kg, U3=2750kg

[0045] 3. Proper amount of formic acid, alkali and triethanolamine

[0046] The preparation process of the surface layer low molar ratio UF resin adhesive is as follows:

[0047] 1. Add formaldehyde (48%), stir and add alkali to adjust the pH to 8.4-8.5;

[0048]2. Add U1, slowly heat up to 85°C in 30-35 minutes, measure pH, keep warm for 20 minutes, before the end of the heat preservation, the pH should not be lower than 6.9, and measure the pH and viscosity at the end of the heat preservation;

[0049] 3. Control the temperature at 80-85°C, add formic acid twi...

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Abstract

The invention belongs to the field of man-made boards, and relates to preparation methods and application of low mole ratio UF resin adhesive and high mole ratio MUF resin adhesive. The preparation method of the low mole ratio UF resin adhesive comprises the steps that urea is added for three times, and the mole ratio of formaldehyde to the sum of the urea participating reaction is 0.92-0.95; the mole ratio of the formaldehyde to the urea added in the first time is 2.0-2.2; the mole ratio of the formaldehyde to the sum of the urea added in the first time and the urea added in the second time is 1.35-1.5. The preparation method of the high mole ratio MUF resin adhesive comprises the steps that melamine is added, the urea is added for three times, and the mole ratio of the formaldehyde to the sum of all the urea and the melamine is 1.00-1.03; the mole ratio of the formaldehyde to the sum of the urea added in the first time and the melamine is 2.0-2.2, and the mole ratio of the formaldehyde to the sum of the urea added in the first time and the second time and the melamine is 1.35-1.50. The invention further discloses application of the prepared adhesive in shaving boards with the ultralow formaldehyde emission. According to the preparation methods and the application of the low mole ratio UF resin adhesive and the high mole ratio MUF resin adhesive, the binding force of wood shavings in the core layers of the shaving boards is improved, the press speed is improved, and the production efficiency of the boards is improved.

Description

technical field [0001] The invention belongs to the technical field of wood-based panels and relates to the production of wood-based panel adhesives, in particular to the manufacturing methods and applications of low molar ratio UF resin adhesives and high molar ratio MUF resin adhesives. Background technique [0002] Particleboard is a board made of wood scraps (wood shavings, sawdust or similar materials) or non-wood plant scraps (flax, bagasse, wheat straw, straw or similar materials) and adhesives. "Particle board" and other titles are a kind of man-made board made by cutting wood and other raw materials into pieces of certain specifications, drying, mixing with adhesives, hardeners, and waterproofing agents, and pressing at a certain temperature. Because the particleboard structure is relatively uniform and the processing performance is good, it can be processed into large-format boards according to needs. It is a good raw material for making furniture of different spec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/24C09J161/30C08G12/12C08G12/38B27N1/00B27N1/02B27N3/08
Inventor 陈秀兰王俊伟王丽朱光华
Owner DARE TECH GROUP
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