Micro-morphology measuring system of XYZ-[beta] dour-dimensional scanning probe

Abstract

The invention discloses a micro-morphology measuring system of an XYZ-[beta] dour-dimensional scanning probe, and relates to the technical field of micro-structure processing and micro-structure surface quality detection. The micro-morphology measuring system mainly comprises an XYZ-[beta] dour-dimensional scanning module, a micro-probe module, a signal analysis processing module and the like. The XYZ-[beta] dour-dimensional scanning module consists of a pedestal, an XYZ micro-shift platform and a [beta] rotation bearing. By cooperating with the micro-probe module, the XYZ-[beta] dour-dimensional scanning module can detect surface morphological changes of a sample in a three-dimension space. After a scan signal is processed by the signal analysis processing module, the surface morphology of the sample can be reconstructed. A relative included angle between the sample and the micro-probe module can be corrected in real time during a morphology measuring process, the maximum detection angle of the morphology measuring system can be increased, the sensitive feature of the sample gradient can be less affected by measuring errors, a to-be-detected sample and a micro-probe are prevented from mechanically damaged, the micro-morphology with complicated surface features can be measured reliably, and the measuring precision is improved.

Description

technical field [0001] The invention relates to the technical field of microstructure processing and microstructure surface quality detection, in particular to an XYZ-β four-dimensional scanning probe microtopography measurement system. Background technique [0002] With the development of precision processing technology, various microstructure devices are constantly appearing. These microstructure devices usually have complex surface geometry features, such as vertical sidewalls, steep slopes, sharp tip angles, etc. When measuring the microstructure surface topography with complex surface features, the sample topography distortion and noise interference in the measurement results are the technical problems that need to be solved urgently in the current precision topography measurement. [0003] Precision shape measurement technology mainly includes two categories: non-contact measurement and contact measurement. [0004] Non-contact measurement mainly includes optical-base...

AI Technical Summary

Problems solved by technology

The disadvantages of this type of measurement technology are: limited by the numerical aperture of the objective lens, the measurement system has a small maximum measurable angle, the measurement error is very sensitive to the slope of the measured surface shape, and there is obvious noise and signal distortion when measuring a surface with a large slope, and even not measurable

The disadvantage of the mechanical probe type profiler is that the maximum detectable angle of the probe tip is 45 degrees or 60 degrees. When measuring the microstructure surface with large slope characteristics, it is prone to contour interference and probe inertia jumping, resulting in inaccurate Measuring the surface topography of samples

The disadvantages of scanning probe microscopy are: the lateral measurement range is generally 10 microns to 100 microns, and the longitudinal measurement range is less than 10 microns, so scanning probe microscopy is usually used for the topography measurement of nanostructures, not for microstructures

The disadvantage of the three-coordinate measuring machine is that the size of the probe tip is too large, and its minimum size is in the range of tens to hundreds of microns. When it is used in the detection of microstructure morphology, it is easy to produce measurement blind spots, resulting in distortion of measurement results.

However, due to the constraints of the maximum detectable angle of various measurement techniques and the sensitivity of measurement errors to sample slope and other factors, for the measurement of microtopography with complex surface features, the measurement results will introduce errors that cannot be compensated or exceed the allowable limit. Measurement errors, reducing measurement accuracy and measurement reliability

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