A kind of hollow metal microneedle and batch preparation method thereof

A microneedle and metal technology, applied in the field of medical equipment and biomedicine, can solve the problems of inability to produce micro-sized needles, etc., and achieve the effect of low cost, guaranteed stability, and reasonable microneedle structure

Active Publication Date: 2018-04-10
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to address the shortcomings of the existing methods, to provide a hollow metal microneedle and its batch preparation method, to solve the problem that the traditional injection head production process cannot produce micro-sized needles, and the size of the prepared microneedles can be adjusted according to needs, and at the same time The accuracy and repeatability of microneedle size control can be fully guaranteed

Method used

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  • A kind of hollow metal microneedle and batch preparation method thereof
  • A kind of hollow metal microneedle and batch preparation method thereof
  • A kind of hollow metal microneedle and batch preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0058] The prepared microneedle includes a needle head and a needle seat, and the side wall of the first layer of the needle head is vertical, such as figure 1 shown.

[0059] The first layer of vertical hollow metal microneedles on the side wall, the process is as follows:

[0060] Firstly, a glass sheet is selected as a substrate, and after cleaning, a chromium / copper seed layer is sputtered. Metal copper is electroplated on the seed layer as the release layer, the electroplating thickness is 1 μm, and the electroplating rate is 0.05 μm / min. Then cast a positive resist on the metal release layer, with a thickness of 10 μm, and use a mask to photoetch the first layer of microneedle structure patterns. Direct electroplating of metal nickel to fill the pattern to make the first layer of microneedles. The plating rate is 0.05 μm / min, and the plating thickness is 10 μm.

[0061] Then, the gold seed layer is sputtered, and the positive resist is shaken by 10 μm, and the channe...

Embodiment 2

[0064] The prepared microneedle includes a needle head and a needle seat, and the section of the needle head is approximately elliptical, which is close to a traditional injection needle; the needle seat is convenient for connecting the microneedle with other parts, and at the same time enhances the strength of the microneedle.

[0065] The needle section is similar to the elliptical hollow metal microneedle, and the process is as follows:

[0066] The whole process is as Figure 6 As shown, a glass sheet 1 is first selected as a substrate, and after cleaning, a chromium / copper seed layer 2 is sputtered. Metal copper 3 is electroplated on the seed layer as a release layer, the electroplating thickness is 5 μm, and the electroplating rate is 0.2 μm / min. Then throw positive glue 4 on the metal release layer with a thickness of 50 μm, and use Figure 5 The mask 1 shown in the photocuts the pattern of the first layer structure of the microneedles. The patterned photoresist 4 is...

Embodiment 3

[0070] There is no needle seat, and the needle profile is similar to an elliptical hollow metal microneedle. The process is as follows:

[0071] Firstly, a glass sheet is selected as a substrate, and after cleaning, a chromium / copper seed layer is sputtered. Metal copper is electroplated on the seed layer as the release layer, the electroplating thickness is 20 μm, and the electroplating rate is 0.5 μm / min. Subsequently, positive resist was cast on the metal release layer with a thickness of 90 μm, and the structure pattern of the first layer of microneedles was photoetched using a needle-only mask. The patterned photoresist is programmed to bake to make the side wall of the pattern inclined and smooth, the heating rate is 1°C / min, and the maximum bake temperature is 90°C.

[0072] Electroplating metal nickel to fill the pattern to make the first layer of microneedles, the electroplating rate is 0.5 μm / min during electroplating, and the electroplating thickness is 90 μm. The...

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Abstract

The invention provides a hollow metal microneedle and a batch preparation method thereof. The steps are: (1) sputtering a metal seed layer on a substrate as a conductive layer; (2) electroplating a metal layer on the conductive layer as a release layer; (3) (4) electroplating metal to fill the pattern, making the first layer of microneedles, and then sputtering the metal seed layer; (5) throwing the photoresist on the metal seed layer and patterning; (6) ) The patterned photoresist is properly baked; (7) The metal seed layer is sputtered; (8) The photoresist is thrown off and patterned, and the metal is electroplated to make the second layer of microneedles; (9) The glue is removed to release the microneedles. The present invention adopts the micro-machining technology, and overcomes the difficulty that the traditional injection needle production technology is difficult to manufacture extremely fine needles in batches.

Description

technical field [0001] The invention relates to the technical fields of medical equipment and biomedicine, in particular to a hollow metal microneedle and a batch preparation method thereof. Background technique [0002] The production of microneedles benefits from the development of micromachining technology and its application in the medical field. Microneedles generally refer to microneedles with lengths ranging from hundreds of microns to several millimeters and tip diameters ranging from several microns to hundreds of microns. Compared with traditional injection needles, the size of microneedles has been significantly reduced. At the same time, it is basically impossible to produce such micro-needles with traditional injection needle production technology, and the introduction of micro-machining technology just solves this problem. [0003] Human skin consists of epidermis, dermis and subcutaneous tissue from the outside to the inside. The outermost layer of the epid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61M37/00
Inventor 丁桂甫刘龙
Owner SHANGHAI JIAO TONG UNIV
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