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ESOP8 lead frame of medium-and high-power LED driving chip

A technology of LED driver and lead frame, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems that cannot be realized, place two chips at the same time, and cannot place two chips, so as to reduce the probability of separation and avoid the overall temperature Effect of rising and increasing MOSFET chip size

Active Publication Date: 2015-07-29
广州华微电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, all current ESOP8 designs are single-base island designs, and it is impossible to place two chips (control chip and MOSFET chip) on one base island.
Although people have made many attempts, such as using non-conductive curing glue to fix the control chip, due to the limitations of current materials, the ESOP8 packaging method still cannot realize the solution of placing two chips on one base island at the same time

Method used

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  • ESOP8 lead frame of medium-and high-power LED driving chip
  • ESOP8 lead frame of medium-and high-power LED driving chip
  • ESOP8 lead frame of medium-and high-power LED driving chip

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no. 1 example

[0033] Aiming at the problem that the ESOP8 packaging structure of the prior art cannot place two different chips, the present invention designs a brand-new SOP8 lead frame, which can not only use the ESOP8 packaging form with low cost and high production efficiency, but also place two different chips. chip.

[0034] The new lead frame design of the present invention divides an independent base island of the ESOP8 package structure into two independent independent base islands of different sizes. Through this design change, one side of the first base island 2 is connected to the external connecting body of the frame through the side connecting rib, and plays a role of a supporting point; while the other side is directly connected to one of the pins. link and act as another support point. The width of the first base island is small, usually in the range of 0.8-1.2mm, but enough to accommodate a control chip. The upper and lower ends of the base island are partially silver-pla...

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Abstract

The invention discloses an ESOP8 lead frame of a medium-and high-power LED driving chip. The ESOP8 lead frame comprises pins, a side connecting rib, a first base island and a second base island, wherein the first base island is used for bearing a control chip, and the second base island is used for bearing an MOSFET chip. One side of the first base island is connected with a frame exterior connector through the side connecting rib to serve as a supporting point of the first base island, and the other side of the first base island is directly connected with one pin to serve as another supporting point of the first base island; one side of the second base island is connected with the frame exterior connector through the side connecting rib to serve as a supporting point of the second base island, and the other side of the first base island is directly connected with two pins to serve as another supporting point of the second base island; the height of the first base island is larger than that of the second base island. The ESOP8 lead frame has the advantages that the cost is low, the size is small, the two chips can be placed at the same time, and the heat dissipation performance is good. The ESOP8 lead frame can be widely applied to the field of semiconductor devices.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to an ESOP8 lead frame for medium and high-power LED driver chips. Background technique [0002] The package of SOP8 is a very popular small patch type, which is generally adopted by the current semiconductor chip package. At present, the LED driver chips based on the SOP8 package and with a built-in MOSFET chip adopt the design scheme of double base islands. One control chip is placed on the top of one base island, and a MOSFET chip is placed on the other base island, such as figure 1 shown. Compared with low-power LED driver chips, medium and high-power LED driver chips need to use a MOSFET chip with a larger conduction current on the base island. When the LED driver chip is working, due to the presence of a MOSFET chip with a large conduction current on it, more heat energy will be generated. However, due to the limitation of the volume of SOP8 and the packaging structure, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62
CPCH01L33/62
Inventor 姜喆姜英伟
Owner 广州华微电子有限公司
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