Novel paperboard adhesive and preparation method thereof
A technology of adhesives and paperboards, applied in the direction of adhesive types, starch adhesives, non-polymer adhesive additives, etc., can solve the problems of difficulty in meeting production needs, poor compression resistance, moisture resistance, and dry adhesion Long time and other problems, to achieve the effect of improving quality, excellent performance, scientific and reasonable preparation method
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Embodiment 1
[0015] Embodiment 1: a kind of novel cardboard adhesive, this adhesive is made up of mixing water, tapioca starch, sodium hydroxide, strengthening agent, borax, and the mass ratio of each component is: water 84%, tapioca starch 13%, Sodium hydroxide 1%, enhancer 1.8%, borax 0.2%. As the reinforcing agent, epoxy resin or the like can be used. In this embodiment, epoxy resin is used.
[0016] The preparation method is as follows:
[0017] a. Add water to the first mixing tank, first add one-seventh of the total amount of tapioca starch, and stir for 10-15 minutes to make it evenly mixed;
[0018] b. Add sodium hydroxide into the first mixing tank, stir evenly, and make mature glue;
[0019] c. Inject water into the second mixing tank, add the enhancer, and add the remaining 6 / 7 of the tapioca starch, stir and mix evenly to make raw rubber;
[0020] d. Inject the cooked glue in the first mixing tank into the second mixing tank and stir for 15-20 minutes;
[0021] e. Finally ...
Embodiment 2
[0022] Embodiment 2: A kind of novel cardboard adhesive, this adhesive is made up of water, tapioca starch, sodium hydroxide, epoxy resin, borax mixing, and the mass ratio of each component is: water 81%, tapioca starch 17% , sodium hydroxide 0.5%, epoxy resin 1%, borax 0.5%. The preparation method of the adhesive is the same as in Example 1.
Embodiment 3
[0023] Embodiment 3: A kind of novel cardboard adhesive, the component of this adhesive and mass ratio are: water 80%, tapioca starch 18%, sodium hydroxide 0.5%, reinforcing agent 1%, borax 0.5%. The preparation method of the adhesive is the same as in Example 1.
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