Matching die cutting and half-and-half rotating pasting processing method for conductive adhesive

Abstract

The invention relates to a matching die cutting and half-and-half rotating pasting processing method for conductive adhesive. The matching die cutting and half-and-half rotating pasting processing method for the conductive adhesive includes the following steps of 1, typesetting and designing; 2, die cutting mode designing; 3, waste scheme designing; 4, product rotating pasting. After die cutting is performed on a single product, the half-and-half rotating pasting technology is adopted. The half-and-half rotating pasting technology comprises the steps that a row of products are pasted in a rotating mode, after material strips are cut, and the other half products are reposted; two strips of box sealing tape with the width of 5 mm are needed in product rotating pasting, a single PCS product is firstly fixed, dislocation or amount missing are prevented, then face paper on the conducting adhesive is removed, the original two rows of side-by-side products which are designed through the up-down and front-back rope winding are changed into products by rotating pasting in sequence and material strap cutting in sequence, therefore, the typesetting of a client is restored, and products the customer needed are manufactured. The matching die cutting and half-and-half rotating pasting processing method for the conductive adhesive improves the use efficiency of conducting resin materials, the waste materials in the manufacturing process are eliminated, the blade collapse is prevented, the normal production is guaranteed, and the production efficiency is improved; the conducting resin product rotating pasting is achieved, and the product typesetting is restored.

Description

technical field [0001] The invention relates to a processing method for paired die-cutting and half-transfer of conductive adhesive, which belongs to the technical field of automatic mounting conductive adhesive circular cutter machining methods. Background technique [0002] The existing conductive tape cover has an irregular shape. If the typesetting specified by the customer is maintained, the handle of the product and the conductive tape will be die-cut separately, and the amount of conductive adhesive used per unit PCS product will remain the same. There is no way to save, and there is a lot of room for product cost reduction. Small, low utilization rate of conductive adhesive material; if the handle and conductive adhesive are die-cut separately, it will be difficult to ensure that the conductive adhesive on the handle is flush, or concave, or protruding, affecting the appearance and size, and the risk of product NG is high . [0003] Furthermore, keeping the typesett...

AI Technical Summary

Problems solved by technology

Compared with the above-mentioned processing technology, the appearance and size problems are solved, but the material cost remains unchanged, and the entire product price has no competitive advantage

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