Vapor deposition method and vapor deposition device

Abstract

The invention provides a vapor deposition method which comprises the following steps: an evaporation source evaporates vapor deposition material granules toward a transfer printing substrate to form an intermediate material layer on the surface of the transfer printing substrate, wherein the surface area of the vapor deposition material granules received by the transfer printing substrate is greater than the area of the outlet of the evaporation source; and the transfer printing substrate is heated to perform vapor deposition on the intermediate material layer on the transfer printing substrate toward the target substrate, wherein the temperature of the heated transfer printing substrate is lower than that of the evaporation source. Correspondingly, the invention also provides a vapor deposition device. The vapor deposition method can reduce the influence of high temperature on the target substrate, and enhances the vapor deposition precision.

Description

technical field [0001] The invention relates to the field of manufacturing display devices, in particular to an evaporation method and an evaporation device. Background technique [0002] Organic Light Emitting Diode (OLED) has many advantages such as fast response speed, brilliant color, good temperature characteristics, wide viewing angle, low power consumption, etc., and has received increasing attention. [0003] The OLED display device includes an organic material layer, and the existing mainstream technology for manufacturing the organic material layer is the method of line source evaporation and scanning. Such as Figure 1a and Figure 1b It is a schematic diagram of evaporation scanning in the prior art. Usually, the temperature of the evaporation source is higher, so that the evaporation material can be evaporated towards the substrate at a faster speed, but the high temperature will make the mask plate 50 and the target substrate 40 A certain deformation occurs, ...

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Problems solved by technology

like Figure 1a and Figure 1b It is a schematic diagram of evaporation scanning in the prior art. Usually, the temperature of the evaporation source is higher, so that the evaporation material can be evaporated towards the substrate at a faster speed, but the high temperature will make the mask plate 50 and the target substrate 40 A certain deformation occurs, which leads to a decrease in the deposition accuracy

On the other hand, in order to make the thickness of the target film layer 60 formed on the target substrate more uniform during the line source evaporation scanning, the evaporation source 10 is usually arranged under the target substrate 40 and the mask plate 50, and is aligned from bottom to top. The target substrate is evaporated, but due to the high gravity of the mask plate, a large gap will be generated between the middle position of the target substrate 40 and the mask plate 50, thereby affecting the evaporation accuracy.

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