Dough sheet fermentation process and continuous fermentation device
A dough and proofing technology, applied in the directions of dough fermenter, dough processing, baking, etc., can solve problems such as the influence of proofing on the bottom of the dough, the low efficiency of standing proofing, the uneven temperature and humidity on the front and back, etc. To achieve the effect of increasing the proofing effect, the product moisture is uniform, and the effect of uniform proofing
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0028] Embodiment 1: The initial average water content of the dough sheet is 38%, and the thickness is 10mm. The first stage temperature is 33°C, the humidity is 88%, and the duration is 5 minutes; the second stage temperature is 38°C, the humidity is 90%, and the duration is 10 minutes; the third stage temperature is 35°C, humidity is 86%, and the duration is The time is 5 minutes.
Embodiment 2
[0029] Example 2: The initial average water content of the dough sheet is 40%, and the thickness is 15mm. The first stage temperature is 35°C, the humidity is 88%, and the duration is 6 minutes; the second stage is 39°C, the humidity is 88%, and the duration is 12 minutes; the third stage is 32°C, the humidity is 80%, and the duration is The time is 6 minutes.
Embodiment 3
[0030]Embodiment 3: The initial average water content of the dough sheet is 35%, and the thickness is 20mm. The first stage temperature is 34°C, the humidity is 85%, and the duration is 7 minutes; the second stage is 40°C, the humidity is 90%, and the duration is 14 minutes; the third stage is 37°C, the humidity is 85%, and the duration is The time is 7 minutes.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com