Structure of AND and NOR-logic devices and making method
A logic device and device technology, applied in the field of integrated circuit manufacturing, can solve the problems of large chip area, high cost, complex circuit structure, etc., and achieve the effect of reducing manufacturing cost, simple timing control, and simple device and circuit structure
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[0040] In order to have a more specific understanding of the technical content, characteristics and effects of the present invention, now in conjunction with the accompanying drawings, the details are as follows:
[0041] For the logic device structure of the present invention, please refer to image 3 , 4 shown.
[0042] And logic devices are fabricated in p-well or p-type substrates. There are two adjacent gates on the top, each of which controls the adjacent n-type conductive channel below it. There is a highly doped n-type source region and a drain region at both ends of the gate control gate, and the source region, two channels and the drain region form a series channel with leads at both ends. There is a polysilicon gate above the two gate control gates respectively, and the two polysilicon gates can be separated from each other, adjacent to each other or overlap each other, but they must be electrically isolated from each other and drawn out independently.
[0043] ...
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