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Capacitor module, method of manufacturing same, and vehicle inverter having same

A technology of capacitors and inverters, which is applied in the field of automotive inverters and can solve problems such as poor performance

Active Publication Date: 2018-06-08
HYUNDAI MOBIS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] In addition, packaging solutions in which MLCCs are soldered with smaller capacitors used as digital circuits on PCBs have poor performance in vehicle environments including vibration, shock, and thermal shock, etc.

Method used

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  • Capacitor module, method of manufacturing same, and vehicle inverter having same
  • Capacitor module, method of manufacturing same, and vehicle inverter having same
  • Capacitor module, method of manufacturing same, and vehicle inverter having same

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Embodiment Construction

[0040] Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the invention may encompass different forms and should not be construed as limited to the embodiments set forth herein. Of course, these embodiments are provided to make this disclosure comprehensive and complete, and to fully convey the protection scope of the present invention to those skilled in the art. Throughout this disclosure, like reference numerals refer to like parts throughout the drawings and embodiments of the invention.

[0041] In each drawing, the same reference numerals are used to describe the same elements.

[0042] Although terms like first, second, etc. are used to describe various elements, these elements should not be limited by these terms. These terms may be used for the purpose of distinguishing one element from another.

[0043] For example, a first element may be called a second element without...

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Abstract

A capacitor module, a method of manufacturing the same, and a vehicle inverter having the same. A capacitor module may include: a case configured to have an opening formed on one surface thereof; and a plurality of multilayer ceramic chip capacitor arrays disposed inside the opening and configured to include a set Multiple Multilayer Ceramic Chip Capacitors (MLCCs) in it.

Description

[0001] Cross References to Related Art [0002] This application claims the benefit of Korean Patent Application No. 10-2013-0168240 filed on December 31, 2013, the entire contents of which are incorporated herein by reference. technical field [0003] Exemplary embodiments of the present invention relate to a capacitor module, and more particularly, to a capacitor module using a multilayer ceramic chip capacitor (MLCC), and a method of manufacturing the same. [0004] In addition, exemplary embodiments of the present invention relate to an inverter for a vehicle using a capacitor module of a multilayer ceramic chip capacitor. Background technique [0005] In an automotive inverter, a direct current (DC) capacitor is electrically connected in parallel between a battery and an insulated gate bipolar transistor (IGBT) to rectify power and absorb switching noise, thereby stabilizing the power system. Such a DC capacitor is generally configured with a film type capacitor having...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/38H01G4/224
CPCH01G2/06H01G2/10H01G4/224H02M7/003H01G4/38H01G2/04Y10T29/435H01G4/33
Inventor 黄俊河
Owner HYUNDAI MOBIS CO LTD
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