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Circuit board with side metal structure and method of making the same

A metal structure, circuit board technology, applied in the direction of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of burr residue, affecting reliability and appearance, and achieve the effect of improving product reliability and improving product appearance.

Active Publication Date: 2018-01-26
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Practice has found that the above method has the following defects: when milling the shape, because the milling cutter passes through the metallized groove, it will cause the metallized inner wall of the groove (hole copper) to be pulled into wires, forming burrs and remaining on the metallized groove, which affects reliability. sex and appearance

Method used

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  • Circuit board with side metal structure and method of making the same
  • Circuit board with side metal structure and method of making the same
  • Circuit board with side metal structure and method of making the same

Examples

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Embodiment 1

[0025] Please refer to figure 1 , an embodiment of the present invention provides a method for manufacturing a circuit board with a side metal structure, which may include:

[0026] 110. A circuit substrate is provided, and the circuit substrate includes at least one circuit board unit; at least one set of through holes is processed on at least one boundary line of the peripheral area of ​​at least one of the circuit board units, and the set of through holes specifically includes two through holes; and, processing a side groove located in the circuit board unit area and adjacent to the boundary line on the circuit substrate, the two ends of the side groove are respectively adjacent to the two through holes, but the side groove is adjacent to the two through holes Not connected.

[0027] In the embodiment of the present invention, the circuit substrate may be a copper-clad laminate or a multi-layer laminate based on the copper-clad laminate, and the copper-clad laminate may be...

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PUM

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Abstract

The invention discloses a method for manufacturing a circuit board with a side metal structure to solve the above-mentioned defects in the existing side metallization process of the circuit board. The above method includes: providing a circuit substrate comprising at least one circuit board unit; processing at least one group of two through holes on at least one boundary line of the peripheral area of ​​at least one circuit board unit; processing on the circuit substrate located at In the side groove in the area of ​​the circuit board unit and adjacent to the boundary line, the two ends of the side groove are respectively adjacent to the two through holes, but the side groove is not connected to the two through holes; Fill the two through holes with resin or metal paste and solidify; metallize the inner wall of the side groove to form the metallized side wall of the circuit board unit; cut the circuit board, and cut the path passing through the two through holes and the adjoining places of the side grooves and the two through holes; removing the adjoining places of the side grooves and the two through holes by drilling.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board with a side metal structure and a manufacturing method thereof. Background technique [0002] Currently, there is a circuit board with a side metal structure, which supports a variety of soldering methods, and is suitable for packaging electronic components with more pins, such as chips. [0003] The production method of this kind of circuit board is: first drill the groove, then sink copper, electroplate to thicken, do pattern electroplating, metallize the inner wall of the groove, and finally mill off half of the metallized groove through the milling process to form the side wall metal A chemical tank is used to produce a circuit board with a side metal structure. [0004] Practice has found that the above method has the following defects: when milling the shape, because the milling cutter passes through the metallized groove, the metallized inner wall o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00
Inventor 王蓓蕾刘宝林
Owner SHENNAN CIRCUITS
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