Adhesive film, dicing/die-bonding film, method for manufacturing semiconductor device, and semiconductor device

A technology of die-bonding film and manufacturing method, which is applied in the direction of film/sheet adhesive, semiconductor/solid-state device manufacturing, semiconductor device, etc., can solve the coating amount of paste adhesive, coating shape deviation, Difficulty in homogenization and the need for special equipment, etc., to prevent the communication speed from decreasing and improve the yield

Active Publication Date: 2015-06-24
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, paste-like adhesives have large variations in the coating amount, coating shape, etc., making it difficult to uniformize, or requiring special equipment and a long time for coating.

Method used

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  • Adhesive film, dicing/die-bonding film, method for manufacturing semiconductor device, and semiconductor device
  • Adhesive film, dicing/die-bonding film, method for manufacturing semiconductor device, and semiconductor device
  • Adhesive film, dicing/die-bonding film, method for manufacturing semiconductor device, and semiconductor device

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no. 1 Embodiment approach

[0103] A first embodiment of the present invention is an adhesive film for embedding a first semiconductor element fixed on an adherend and for fixing a second semiconductor element different from the first semiconductor element to the adherend. things,

[0104] It is at 120°C and the shear rate is 50s -1 The melt viscosity under is 50 Pa·s or more and 500 Pa·s or less.

Embodiment approach 1-1

[0106] In Embodiment 1-1, such as figure 1 As shown, the following description will be made taking, as an example, the form of a dicing / die-bonding film in which an adhesive film 22 for embedding is laminated on a dicing film 5 in which an adhesive layer is laminated on a substrate 4 3 made. In this embodiment mode, a mode in which the electrical connection between the adherend and the first semiconductor element is realized by wire bonding connection will be described.

[0107] Adhesive film

[0108] In the adhesive film 22, at 120°C and at a shear rate of 50s -1 The melt viscosity under is set to 50 Pa·s or more and 500 Pa·s or less. The lower limit of the melt viscosity is preferably 60 Pa·s or more, more preferably 70 Pa·s or more. The upper limit of the melt viscosity is preferably 400 Pa·s or less, more preferably 300 Pa·s or less. By adopting the above-mentioned upper limit, when using the adhesive film to fix the second semiconductor element to the adherend, th...

Embodiment approach 1-2

[0235] In Embodiment 1-1, the step of fixing the first semiconductor element to the adherend is performed by bonding a film, and the electrical connection between the two is realized by wire bonding, while in Embodiment 1-2, by using The flip-chip connection of the protruding electrodes of the first semiconductor element realizes the fixing and electrical connection between the two. Therefore, Embodiment 1-2 differs from Embodiment 1-1 only in the fixing method in the first fixing step, and therefore the difference will be mainly described below.

[0236] 1st fixed process

[0237] In this embodiment, in the aforementioned first fixing step, the first semiconductor element 41 is fixed to the adherend 1 by flip-chip connection (see Figure 4A ). In the flip-chip connection, the circuit surface of the first semiconductor element 41 faces the adherend 1, so-called face-down mounting. A plurality of protruding electrodes 43 such as bumps are provided on the first semiconducto...

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Abstract

The present invention relates to an adhesive film, a dicing / die-bonding film, a method for manufacturing a semiconductor device, and the semiconductor device. The present invention provides an adhesive film capable of manufacturing a high-reliability semiconductor device with good yield and application thereof. The present invention provides an adhesive film used for embedding a first semiconductor component fixed on an adherend and fixing a second semiconductor component different from the first semiconductor component on the adherend, and the melt viscosity under 120 DEG C at a shear velocity below 50s<-1> is preferably more than 50 Pa*s and less than 3000 Pa*s. Storage modulus of the adhesive film before thermofixation under 25 DEG C is preferably more than 10 Mpa and less than 10000 Mpa.

Description

technical field [0001] The present invention relates to an adhesive film, a dicing / die-bonding film, a method for manufacturing a semiconductor device, and a semiconductor device. Background technique [0002] Hitherto, silver pastes have been used to fix semiconductor chips to substrates and electrode members when manufacturing semiconductor devices. This fixing process is performed by coating a semiconductor chip or a lead frame with a paste-like adhesive, mounting the semiconductor chip on a substrate via the paste-like adhesive, and finally curing the paste-like adhesive layer. [0003] However, paste-like adhesives have large variations in the coating amount, coating shape, etc., making it difficult to uniformize, or requiring special equipment and a long time for coating. Therefore, there has been proposed a dicing / die-bonding film that adheres and holds a semiconductor wafer in a dicing process and also imparts an adhesive film for chip mounting required in a mountin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L21/56C09J7/02
CPCH01L2224/92247H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/48091H01L2224/73265H01L2924/00014C09J7/00H01L2924/181C09J2203/326C09J2301/312
Inventor 宍户雄一郎三隅贞仁大西谦司
Owner NITTO DENKO CORP
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