Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A reconfigurable embedded computer-on-module based on sip

An embedded computer and control computer technology, applied in the field of missile-borne weapon systems, can solve the problems of difficulty in reliability design and prolong the life cycle of software systems, so as to improve versatility and flexibility, improve system reliability, and reduce system power. consumption effect

Active Publication Date: 2017-07-04
郑州兴航科技有限公司
View PDF11 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the previous design, FPGA has been widely used in the missile signal processing system and has become the core device of the missile computer, but its reliability design in the environment is a difficult problem
On the one hand, FPGA software may be affected by the external space environment and cause various problems, the consequences of which are serious or even catastrophic; on the other hand, when the FPGA software itself has design defects or changes in application requirements due to weapon systems, If the update and upgrade of FPGA software can be realized in the environment without bomb disposal, the life cycle of the software system can be extended, and the economic benefits generated at the same time are immeasurable

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A reconfigurable embedded computer-on-module based on sip
  • A reconfigurable embedded computer-on-module based on sip
  • A reconfigurable embedded computer-on-module based on sip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0039] see figure 1 , the present invention is based on the minimum system SiP module developed by LCDSP0101 high-speed DSP, wherein FPGA selects QPro Virtex 2.5V series JQV600-4, SBSRAM selects memory LCSM128K32, and the single-chip capacity of this chip is 128K×32bit (4Mbit), and FLASH selects 2 pieces JFM29LV160 (1M×16bit), single-chip capacity is 1M×16bit, when configured in word mode, it has one 8K word sector, two 4K word sectors, one 16K word sector, and 31 32K word sectors The sector of words, the codes of different functions of FPGA can be stored in different sectors of FLASH. In addition, the module also includes 4 RS-422A intelligent serial asynchronous communication interfaces, and the communication between peripherals and the module is realized through the RS-422 communication interface.

[0040] figure 1 The circuit b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a reconfigurable embedded computer module based on SiP. The reconfigurable embedded computer module comprises a minimum system SiP module based on A DSP. The SiP module comprises the DSP, an FPGA, a bootstrap configuration unit and a configuration data interface unit. The function and performance of the reconfigurable embedded computer module and the determination of the architecture belong to generality extraction based on the requirement analysis of a plurality of type tasks, and therefore the reconfigurable embedded computer module has wide adaptability in function and performance. The DSP+FPGA standard architecture is adopted, the FPGA reconfigurable technology and the SiP miniaturization packaging technology are fully combined, power consumption and the size are reduced, reliability is improved, meanwhile, the application range of the reconfigurable embedded computer module is greatly enlarged through the design of the generality of the reconfigurable embedded computer module, and later maintaining and upgrading are facilitated.

Description

technical field [0001] The invention relates to a reconfigurable embedded computer module based on SiP, which is especially suitable for missile-borne weapon systems with requirements of miniaturization, light weight, high performance and high reliability. Background technique [0002] With the upgrade of the missile weapon system's requirements for missile range, maneuverability, reliability, etc., the overall requirements of the missile system for the miniaturization, light weight, high performance and high reliability of the missile system are getting higher and higher. [0003] In the previous design, the computer circuit built with packaged devices occupied a large printed board area and system volume, which could not meet the development trend of miniaturization and miniaturization of missile systems. [0004] The use of SiP technology can not only reduce the design complexity of the entire system, reduce design risks, and reduce development costs, but also greatly red...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/40
CPCY02D10/00
Inventor 赵亚玲沙李鹏唐艺菁王卫江杨曦仵敏娟周煦林
Owner 郑州兴航科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products