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PCB of LED indicator board for automobile instrument and design method of PCB

A technology for PCB boards and automotive instruments, which is applied to printed circuit parts, electrical components, circuits, etc., can solve the problems of easy damage of LEDs, unfavorable LED heat export, etc., and achieve the effects of avoiding damage, high thermal conductivity, and prolonging service life

Inactive Publication Date: 2015-06-10
AEROSPACE HI TECH HLDG GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the structure of the PCB board of the existing LED indicator board is not conducive to the export of LED heat, thereby causing the LED to be easily damaged, and now provides the PCB board of the LED indicator board for automobile instrumentation and its design method

Method used

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  • PCB of LED indicator board for automobile instrument and design method of PCB
  • PCB of LED indicator board for automobile instrument and design method of PCB

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specific Embodiment approach 1

[0016] Specific implementation mode one: refer to figure 2 Specifically explain this embodiment, the PCB board of the LED indicator board for automobile instrument described in this embodiment, the two pads of each LED are covered with a large-area copper clad layer, and the area of ​​the copper clad layer is larger than that of the LED solder. 3 times the disk area.

[0017] In the PCB board of the LED indicator board for automobile instrument described in this embodiment, the two welding pads of each LED are covered with a large-area copper clad layer. Since copper has good thermal conductivity, this structure is very beneficial. The heat generated by the two electrodes of the LED leads to the copper clad layer and then dissipates, which effectively prevents the LED from being damaged due to the long working time and temperature rise, and prolongs the service life of the LED.

specific Embodiment approach 2

[0018] Specific embodiment 2: This embodiment is a further description of the PCB board of the LED indicator board for automotive instrumentation described in the specific embodiment 1. In this embodiment, the areas of the copper clad layers at the two pads of the same LED are equal .

[0019] Due to the large negative bracket of the LED bracket, the temperature generated by the negative pole during the LED lighting process will be relatively high. Therefore, increasing the copper clad area at the pad corresponding to the LED negative pin can meet the requirements of the manufacturing process characteristics of the LED itself. The purpose of increasing the copper clad area on the pad corresponding to the LED positive pin on the PCB is to meet the characteristics of the welding process, because if the copper clad area of ​​the two pads of the LED differs greatly, it will cause two solder pads in the soldering process. The heating rate of each pad is inconsistent, which increase...

specific Embodiment approach 3

[0020] Specific embodiment three: this embodiment is to further illustrate the PCB board of the LED indicator board for automobile instrument described in specific embodiment one or two. short sides parallel to each other.

[0021] The PCB boards of the LED indicator boards for automobiles are all rectangular, and the length is much greater than the width. In this embodiment, the LEDs are arranged along the length direction of the short side of the printed board. In the process of practical application, due to factors such as the temperature rise of the printed board, it will cause deformation, that is, the rectangular bottom plate is bent and deformed, and the deformation method is that the long side is bent. If the original design method is used, the LEDs are parallel to the long side. This leads to longer or shorter distance between the two pads of the LED under the premise of deformation of the PCB, which in turn causes stress between the two pins of the LED to be welded, ...

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Abstract

The invention provides a PCB of an LED indicator board for an automobile instrument and a design method of the PCB and belongs to the field of the PCBs of the LED indicator boards. The PCB is used for solving the problem that the structure of the PCB of the LED indicator lamp is not advantageous for dissipating the LED heat. The PCB of the LED indicator board for the automobile instrument is characterized in that each of two bonding pads of each LED is covered with a large-area copper coating, and the area of the copper coating is three times larger than the area of the LED bonding pad. According to the design method of the PCB of the LED indicator board for the automobile instrument, the large-area copper coating is designed on each of two bonding pads of each LED and the area of the copper coating is three times larger than the area of the LED bonding pad. The LEDs are effectively prevented from damage due to that the temperature rises along with the working time, and the service life of the LEDs is prolonged. The PCB and the design method are suitable for the design field of the LED indicator boards for the automobile instruments.

Description

technical field [0001] The invention belongs to the technical field of PCB board design of LED indicator boards, in particular to the technical field of PCB board design of LED indicator boards of automobile instruments. Background technique [0002] The LEDs of automotive instruments, namely light-emitting diodes, are now widely used in this field. Some LEDs in the PCB boards of LED indicator boards are often damaged for unknown reasons, which once caused great troubles in the manufacturing field. After careful study, we found the cause of its damage: there are two block-shaped pins inside the LED, which are called LED brackets, and the negative bracket is relatively large because the negative bracket supports the LED chip, and the two positive brackets are Relatively small, when the LED is working, it will generate heat, and the negative pole of the LED bracket is large, so the temperature at this end is high. And because the automotive instrument needs to be turned on fo...

Claims

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Application Information

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IPC IPC(8): H01L33/62H01L33/48H05K1/02
Inventor 张秀颖张瞵颖赵英
Owner AEROSPACE HI TECH HLDG GROUP
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