LED (Light-Emitting Diode) heat-dissipating substrate

Abstract

The invention discloses an LED (Light-Emitting Diode) heat-dissipating substrate, and relates to the field of electrical appliances. The LED heat-dissipating substrate comprises an aluminum substrate, wherein the aluminum substrate is provided with a groove, heat-conducting silicone grease fills the groove, a temperature controller is arranges at the bottom of the aluminum substrate, the temperature controller is connected with a radiator, the aluminum substrate is provided with an insulating layer, the insulating layer is provided with a circuit layer, and the circuit layer is provided with a waterproof layer. The LED heat-dissipating substrate has the characteristics that heat can be dissipated stably, the service life of an LED is prolonged, electric leakage and electric shock accidents of the LED heat-dissipating substrate can be prevented, and liquid such as water can be prevented from splashing onto the heat-dissipating substrate to cause short-circuit accidents.

Description

technical field [0001] The invention relates to the field of electrical appliances, in particular to an LED heat dissipation substrate. Background technique [0002] LED is a PN junction electronic device with optical, electrical and thermal characteristics. The early LED operating current was very low and the heat dissipation requirements were not high, so the heat dissipation problem was rarely considered. With the improvement of LED luminous efficiency and the increase of operating current Now, the problem of heat dissipation has become a very thorny problem in LED applications. At present, many products related to LED heat dissipation have emerged on the market. For example, the document with application number 201310016535.3 discloses LED heat dissipation substrates, including heat-conducting substrates. Among the heat-conducting substrates, at least Embedded with a high thermal conductivity ring, the upper and lower surfaces of the high thermal conductivity ring are re...

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Problems solved by technology

[0002] LED is a PN junction electronic device with optical, electrical and thermal characteristics. The early LED operating current was very low and the heat dissipation requirements were not high, so the heat dissipation problem was rarely considered. With the improvement of LED luminous efficiency and the increase of operating current Now, the problem of heat dissipation has become a very thorny problem in LED applications. At present, many products related to LED heat dissipation have emerged on the market. For example, the document with application number 201310016535.3 discloses LED heat dissipation substrates, including heat-conducting substrates. Among the heat-conducting substrates, at least Embedded with a high thermal conductivity ring, the upper and lower surfaces of the high thermal conductivity ring are respectively flat with the upper and lower surfaces of the heat conduction substrate, and the upper and lower surfaces of the heat conduction substrate at the center of the high thermal conductivity ring are aligned with the lower surface of the LED chip pre-set on the heat conduction substrate. Correspondingly, the structure and process are simple, easy to manufacture, and can significantly improve the heat dissipation efficiency of the heat-conducting substrate, but the LED heat-dissipating substrate cannot solve the problem. How to make the heat-dissipating substrate can dissipate heat stably, prolong the service life of the LED, and how to prevent the LED heat-dissipating substrate from leakage and electric shock Accidents, how to prevent water and other liquids from splashing on the heat dissipation substrate, and short-circuit accidents

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