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Melt-and-play glue melting device

A technology of melting glue and glue tank, which is applied in the field of instant melting glue device, which can solve the problems of affecting production efficiency, long melting time, and increased defect rate of glue injection products, and achieve the effect of saving glue and cleaning costs

Inactive Publication Date: 2015-05-27
SUZHOU KONIG ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current melt glue tank has a long melting time, and the temperature distribution of the liquid glue after melting is uneven.
The waiting time before production is too long due to the long melting time, which seriously affects the production efficiency; at the same time, the defective rate of injection products increases due to the uneven temperature distribution of the melted glue
What's more serious is that the raw materials placed in the melt glue tank are heated repeatedly for a long time, which can easily cause the carbonization of the glue, which not only blocks the glue channel of the machine, but also seriously affects the quality of the encapsulated product.
At the same time, because of the open heating method, the air bubbles enter the melted liquid glue, causing many air bubbles to be wrapped in the encapsulated product, which not only causes the electrical properties of the product to fail to meet the requirements, but also causes the air bubbles in the encapsulated product to When the working environment temperature changes greatly, the solder pins of the electronic components soldered on the circuit board may be "pull apart" due to the shrinkage or expansion of the air bubbles.

Method used

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Embodiment Construction

[0021] The specific implementation of the instant melt adhesive device provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0022] see figure 1 , figure 2 and image 3 As shown, the instant melt glue device of the present invention includes a glue tank 1 and a glue injection gun nozzle 2 . The glue tank 1 is used to store liquid glue, and the glue injection gun nozzle 2 is used to spray liquid glue.

[0023] The instant melt glue device also includes a delivery pipe 3 connected with the glue tank 1 . A hopper 4 is connected with the delivery pipe 3 . The solid glue is loaded through the hopper 4 and enters the delivery pipe 3, where the solid glue is transformed into a liquid glue.

[0024] A screw rod 5 is arranged in the delivery pipe 3, and the screw rod 5 rotates to melt the solid rubber material into a liquid rubber material. The screw rod 5 drives the solid rubber material to rotate, and the solid rub...

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PUM

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Abstract

The invention provides a melt-and-play glue melting device which comprises a glue cylinder, a glue injection gun nozzle, wherein the glue cylinder is used for storing a liquid glue stock; the glue injection gun nozzle is used for jetting the liquid glue stock; the conveying pipe is connected with the glue cylinder; and a screw rod is arranged in the conveying pipe, and rotates to melt a solid glue stock into the liquid glue stock. The melt-and-play glue melting device has the advantages that the boot waiting time can be shortened; the carbonization of the glue stock is removed; and the obtained glue is free of a bubble.

Description

technical field [0001] The invention relates to the field of low-pressure injection molding, in particular to an instant melt glue device. Background technique [0002] The heating method of the existing low-pressure glue injection melting machine is to heat the heat pipe installed at the bottom of the glue tank, and conduct the temperature heated at the bottom of the glue tank to the melt tank through the heating grid and the glue tank barrel, and heat the already heated glue tank through heat conduction. The hot melt adhesive raw material placed in the glue tank is heated and melted. [0003] The current melt glue tank has a long melting time, and the temperature distribution of the liquid glue after melting is uneven. The waiting time before production is too long due to the long melting time, which seriously affects the production efficiency; at the same time, the defective rate of the injection products increases due to the uneven temperature distribution of the melted...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/47B29C47/82B29C47/80
Inventor 朱建晓
Owner SUZHOU KONIG ELECTRONICS TECH CO LTD
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