Electroplating liquid and electroplating method of diethylenetriamine cyanide-free copper plating
A diethylenetriamine, cyanide-free copper plating technology, applied in the field of copper electroplating technology, can solve the problems of unsatisfactory properties of the plating solution, poor quality of the plating layer, etc. Effect
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Embodiment 1
[0034] The formulation of the electroplating solution is as follows:
[0035]
[0036] Plating process conditions: the pulse width of the single pulse square wave current is 1ms, the duty cycle is 30%, and the average current density is 0.2A / dm 2 ; The pH is 9, the temperature is 50° C., and the electroplating time is 80 minutes.
Embodiment 2
[0038] The formulation of the electroplating solution is as follows:
[0039]
[0040] Plating process conditions: the pulse width of the single pulse square wave current is 1ms, the duty cycle is 25%, and the average current density is 0.4A / dm 2 ; The pH is 9.5, the temperature is 45°C, and the electroplating time is 70min.
Embodiment 3
[0042] The formulation of the electroplating solution is as follows:
[0043]
[0044]
[0045] Plating process conditions: the pulse width of the single pulse square wave current is 2ms, the duty cycle is 20%, and the average current density is 0.5A / dm 2 ; The pH is 10, the temperature is 40°C, and the electroplating time is 65min.
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