Vacuum laminating press suitable for various crisp material circuit boards

Abstract

The invention relates to a vacuum laminating press suitable for various crisp material circuit boards, and belongs to the technical field of mechanical manufacturing. The vacuum laminating pres is manly characterized in that a suspending balancing mechanism is connected on the inner top of a main engine framework body, and equipped with a group of small-sized oil cylinders between a fixed plate and a movable plate, wherein the small-sized oil cylinders are fixed on the fixed plate; an oil cylinder communicating tube is arranged between the small-sized oil cylinders; small-sized oil cylinders are communicated with each other through hydraulic oil; internal pressure of each small-sized oil cylinder is kept the same all the time, so that pressure self-balancing of a pressure plate is realized. The movable plate is fixedly connected with an upper pressure plate through a heat insulation plate, and a movable hanging plate is arranged between the fixed plate and the side surface of the movable plate. The vacuum laminating press is simple in structure, low in manufacturing cost, high in automatic laminating planar precision, stable and reliable in work, and high in product finished product rate. Therefore, after the crisp materials of a glass substrate, a ceramic substrate and the like are pressed, inferences caused by instability due to different compactness degrees and different temperatures are avoided.

Description

technical field [0001] The invention relates to a vacuum pressing machine, in particular to a vacuum pressing machine suitable for circuit boards of various brittle materials, belonging to the technical field of mechanical manufacturing. Background technique [0002] The traditional lamination machine is rigid mechanically parallel above and below, without self-adjustment function, it is only suitable for the lamination of common substrates, and has no higher requirements for the balance of substrate plane pressure. Objectively, the pressed material will be non-parallel up and down. Then, the mechanical parallelism of the upper and lower sides of the press will inevitably cause uneven pressure on the pressed material during pressing, resulting in high local pressure and low pressure in some places. Especially for circuit board lamination process and performance requirements with brittle materials as the substrate, it is not allowed, and even cause many adverse results. [0...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the upper platen on the upper part of the press cannot be automatically slightly tilted and adjusted in any direction when the upper and lower sides are not parallel due to the accumulated error of the existing vacuum pressing machine, and it cannot follow the pressing process. The non-parallel surface of the material is slightly inclined, which cannot fit the positive pressure and the brittle material surface very well, so that the pressure of each part is different, thus providing a new technical solution

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