Manufacturing method of titanium focus ring

Abstract

A method for manufacturing a titanium focus ring, comprising: providing a high-purity titanium ingot; processing the high-purity titanium ingot to form a titanium bar; leveling the titanium bar; cutting the titanium bar to form a titanium plate a strip; performing heat treatment on the titanium strip or the titanium strip; processing the titanium strip to form a titanium focus ring. In the manufacturing method, the titanium strip is leveled and the titanium strip or the titanium plate is heat-treated to make the surface of the titanium strip flat, to ensure that the thickness of the subsequently formed titanium focus ring is uniform, and to eliminate the titanium strip or the titanium plate. At the same time, the grains in the titanium strip or the titanium plate are increased, so as to meet the mechanical performance requirements for making the titanium focus ring, and make the formed titanium focus ring difficult to deform.

Description

Technical field [0001] The invention relates to the field of semiconductor technology, in particular to a manufacturing method of a titanium focusing ring. Background technique [0002] Sputtering is a thin film deposition technology commonly used in the production of modern semiconductor chips. It uses high-energy particles to bombard a high-purity target material to make the target material atoms escape from the surface and uniformly deposit on the substrate to form a uniform film After the grinding and polishing process, the barrier layers, interconnections and contact layers of the integrated circuit are formed on the substrate. [0003] However, during the sputtering process, because high-energy particles bombard the target from all directions, the target atoms escaping from the target surface will leave the target surface in all directions, and then reach the wafer surface in a straight line, which cannot guarantee the substrate. The uniformity of the deposited thin film lay...

AI Technical Summary

Problems solved by technology

[0008] The problem to be solved by the present invention is to provide a manufacturing method of titanium focus ring to solve the quality problem of titanium slats in the manufacturing process, thereby improving the size uniformity of each part of the formed titanium focus ring and avoiding the formation of titanium focus rings. The ring deforms during use, ultimately improving the uniformity of the titanium metal film layer formed during sputtering

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