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Alignment method and system of fog process

A process and alignment mark technology, applied in the field of alignment method of FOG process, can solve the problems of flexible printed circuit board position deviation from predetermined position, inaccurate alignment, etc.

Active Publication Date: 2017-07-07
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the accumulative shading of the flexible printed circuit board 120 and the conductive adhesive 112, it is difficult to accurately identify the alignment mark on the touch panel 110 during bonding, so misalignment is prone to occur, resulting in the bonding of the flexible printed circuit board 120. The fixed position deviates from the predetermined position

Method used

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  • Alignment method and system of fog process
  • Alignment method and system of fog process
  • Alignment method and system of fog process

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Embodiment Construction

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0026] figu...

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Abstract

The invention relates to an FOG process alignment method. The FOG process alignment method includes the steps of providing a glass panel with a first alignment mark; photographing the glass panel to generate first image information, and transmitting the first image information to an image processing module; generating second image information with a second alignment mark signal, and transmitting the second image information to the image processing module, wherein the first image information and the second image information are processed through the image processing module to be transmitted to a display module; displaying the image information received from the image processing module through the display module; adjusting the position and the size of a second alignment mark through an alignment mark control module to obtain new second image information, and displaying the new second image information through the display module; placing an FPC with a third alignment mark above the glass panel; photographing the FPC to generate third image information, and displaying the third image information through the display module; adjusting the position of the FPC so that the second alignment mark can be aligned with the third alignment mark. The FOG process alignment method is high in binding accuracy and high in product yield, and the production efficiency can be improved.

Description

technical field [0001] The invention relates to layered products, in particular to an alignment method of FOG technology, and also relates to an alignment system of FOG technology. Background technique [0002] In the manufacturing process of liquid crystal display, touch panel and other products, it is necessary to bond the flexible printed circuit board (FPC On Glass, FOG) on the glass. see figure 1 , a touch panel (Touch Panel) 110 is provided on a substrate (Substrate) 100, and a conductive adhesive 112 is coated on the touch panel 110. The conductive adhesive enables the flexible printed circuit board 120 and the touch panel 110 to be bonded during the bonding process. combine. [0003] Since the flexible printed circuit board 120 must be bonded to a specific position on the touch panel 110 , alignment marks need to be set during the bonding operation. Specifically, alignment marks are respectively provided on the touch panel 110 and the flexible printed circuit boar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1333G06F3/041
CPCG02F1/1303G06F3/041
Inventor 徐奎张月华张向伟
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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