Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thick copper circuit board with inconsistent inner and outer layer copper thickness and preparation method thereof

A technology of thick copper circuit board, inner and outer layers, applied in multilayer circuit manufacturing, printed circuit manufacturing, removing conductive materials by chemical/electrolytic methods, etc., can solve the problems of obvious barrier effect, bubble pressing, uneven heat transfer, etc. , to achieve the effect of good filling effect, no bubbles in pressing, and uniform pressure distribution.

Active Publication Date: 2017-12-05
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the 12OZ thick copper plate is stacked on the inner layer, there is a large space to be filled with resin between the lines, and the circuit board is an outer layer of 6OZ inner layer of 12OZ thick copper plate, which has a large thickness and obvious barrier effect, which is not conducive to filling. Many, uneven heat transfer, prone to problems such as air bubbles and poor pressing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thick copper circuit board with inconsistent inner and outer layer copper thickness and preparation method thereof
  • Thick copper circuit board with inconsistent inner and outer layer copper thickness and preparation method thereof
  • Thick copper circuit board with inconsistent inner and outer layer copper thickness and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] A method for preparing a thick copper circuit board (inner layer 12OZ, outer layer 6OZ thick copper board) with inconsistent copper thicknesses on the inner and outer layers, the circuit board adopts a four-layer structure, wherein the first and fourth circuit layers use 6OZ thick copper foil 12OZ thick copper foil is used for the second and third circuit layers, and the board thickness is 65-81mil.

[0065] The preparation method of this embodiment includes the steps of plate pressing, drilling and etching, and the other steps are prepared according to conventional methods. in:

[0066] (1) In the pressing process, the 1080 prepreg with a resin content of 68% is selected, and the hot pressing process and the cold pressing process are used for pressing in turn; the specific process parameters are shown in the table below.

[0067] Table 1. Setting of pressing plate process parameters

[0068]

[0069]

[0070] In the above-mentioned cold pressing process, the co...

Embodiment 2

[0077] A method for preparing a thick copper circuit board (inner layer 12OZ, outer layer 6OZ thick copper board) with inconsistent copper thicknesses on the inner and outer layers, the circuit board adopts a four-layer structure, wherein the first and fourth circuit layers use 6OZ thick copper foil 12OZ thick copper foil is used for the second and third circuit layers, and the board thickness is 65-81mil.

[0078] The preparation method of this embodiment includes the steps of plate pressing, drilling and etching, and the other steps are prepared according to conventional methods. in:

[0079] (1) In the pressing process, the 1080 prepreg with a resin content of 71% is selected, and the hot pressing process and the cold pressing process are used for pressing in turn; the specific process parameters are shown in the table below.

[0080] Table 3. Setting of pressing plate process parameters

[0081]

[0082] (2) In the drilling process, the board is baked at 120°C for 6 h...

Embodiment 3

[0088] A method for preparing a thick copper circuit board (inner layer 12OZ, outer layer 6OZ thick copper board) with inconsistent copper thicknesses on the inner and outer layers, the circuit board adopts a four-layer structure, wherein the first and fourth circuit layers use 6OZ thick copper foil 12OZ thick copper foil is used for the second and third circuit layers, and the board thickness is 65-81mil.

[0089] The preparation method of this embodiment includes the steps of plate pressing, drilling and etching, and the other steps are prepared according to conventional methods. in:

[0090] (1) In the pressing process, the 1080 prepreg with a resin content of 65% is selected, and the hot pressing process and the cold pressing process are used for pressing in turn; the specific process parameters are shown in the table below.

[0091] Table 5. Setting of pressing plate process parameters

[0092]

[0093] (2) In the drilling process, bake the board at 160°C for 4 hours...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an inner and outer layer copper thickness-differentiated thick copper circuit board and a preparation method thereof and belongs to the PCB technical field. The method includes the steps of board pressing process, drilling process and etching process. According to the board pressing process, a prepreg of which the resin content is equal to or larger than 65% is selected; hot pressing process and cold pressing process are sequentially adopted to perform board pressing; the parameter conditions of the hot pressing process are as follows: pressure ranges from 250 to 450 PSI, temperature ranges from 175 to 220 DEG C, vacuum degree ranges from 0 to 68 cm Hg, and time ranges from 90 to 150 min; and the parameter conditions of the cold pressing process are as follows: pressure ranges from 50 to 450 PSI, temperature ranges from 165 to 220 DEG C, and time ranges from 130 to 230 min. According to the preparation method, a laminated structure and a board lamination mode are adopted, and temperature rising and pressurization control are utilized in cooperation, and therefore, the filling of flowing resin can be uniform, and pressure distribution is uniform when board pressing is performed, and an excellent filling effect can be realized, and air bubble generation can be avoided, and press fit can be excellently realized.

Description

technical field [0001] The invention relates to the technical field of PCB printed circuit boards, in particular to a thick copper circuit board with inconsistent inner and outer copper thicknesses and a preparation method thereof. Background technique [0002] Automotive electronic components, especially in high-power and high-voltage parts such as engine power supply parts and automotive central electrical power supply parts, often use thick copper circuit boards with inconsistent inner and outer copper thicknesses (such as outer layer 6OZ, inner layer 12OZ thick copper circuit boards, etc.) ), the circuit is required to have high reliability characteristics such as heat aging resistance and low temperature cycle resistance. [0003] In the conventional technology, the pressing process of the above-mentioned thick copper circuit board with inconsistent inner and outer layer copper thickness is to laminate the copper foil, prepreg and oxidized inner layer board in order and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/06H05K3/00
CPCH05K3/4611H05K2203/068
Inventor 戴匡
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com