Cyanide-free gold plating electroplate liquid for refractory metal wires

Abstract

The invention relates to cyanide-free gold plating electroplate liquid for refractory metal wires. The cyanide-free gold plating electroplate liquid for refractory metal wires is characterized in that a solution in 1000 volume parts comprises the following components in parts by weight: 10-30 parts of gold chloride, 130-150 parts of anhydrous sodium sulfite, 80-110 parts of potassium citrate, 90-120 parts of potassium chloride, 5-10 parts of ethylene diamine tetraacetic acid disodium salt and 0.5-1 part of saccharin sodium salt. The electroplate liquid can be used for plating refractory metal in filaments and micro filaments; the obtained gold plated wires have the advantages of good bonding force of a plating layer and a base body, good product surface smoothness and high corrosion resistance.

Description

technical field [0001] The invention relates to a metal plating solution, in particular to a cyanide-free gold plating solution for refractory metal wires. Background technique [0002] The melting point and strength of refractory metals are extremely high, so they have unique value in the field of high temperature and ultra-high temperature, plus their good radiation shielding function, and have a good radiation shielding function. Because refractory metals are easily oxidized at high temperature, the extensive development and application of refractory metals are limited. In order to improve the oxidation resistance of refractory metals and expand its application range, it is planned to plate metals with good oxidation resistance and electrical conductivity on the surface of refractory metals to prevent its oxidation. Gold has attracted much attention due to its good ductility, oxidation resistance and electrical conductivity. Gold-plated refractory metal wire can greatly ...

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Problems solved by technology

[0003] Traditional gold-plating baths often contain cyanide. Since cyanide is a highly toxic substance, it has a serious impact on human health and the natural environment. The National Development and Reform Commission stipulated that "cyanide-containing electroplating" was eliminated in 2003, and then cyanide-free electroplating began. It has gradually gained everyone's attention, and extensive research has been carried out. There are many types of cyanide-free electroplating solutions, and the preparation methods are different. At present, the cyanide-free gold plating process is widely used. This method has the following disadvantages: gold is made of KAu(SO3)2 The stability of the plating solution is poor, the gold ions are easily reduced and precipitated, the range of the cathode current density is narrow, and the plating layer contains a small amount of harmful elements such as S, etc.

Because the composition of the plating solution and the preparation process are generally complicated, the thickness of the gold-plated layer of the produced 0.025-0.15mm tungsten wire is 0.3-1.2μm, and the plating layer is uneven and easy to fall off.

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