Spray method and spray device of electrostatic spraying circuit board

Abstract

The invention relates to the technical field of spray methods and discloses a spray method and a spray device of an electrostatic spraying circuit board. The method comprises the following steps: respectively clamping a plurality of circuit boards by clamps, wherein the circuit boards are in a same plane to form a circuit board set; respectively arranging pseudo plates in front of the circuit board set and on the back of the circuit board set and clamping the pseudo plates by using clamps, wherein the two pseudo plates and the circuit boards are located in a same plane and the pseudo plates and the circuit boards are arranged at intervals; grounding the clamps; and spraying the two board faces of the circuit boards by using a spraying machine respectively. The pseudo plates are respectively arranged in front of the circuit board set and on the back of the circuit board set, which is equivalent to extension of the plane formed by the circuit boards, so that oil gathering phenomenon on the left and right plates of the circuit boards can be avoided, printing ink on the circuit boards are relatively uniform, the circuit boards in the subsequent processing are prevented from polluting a conveyer, a film and an exposure machine and oil residues on the board surfaces of the circuit boards and board copper leakage are avoided, thereby greatly improving the quality of the circuit boards, saving the printing ink and greatly lowering the manufacturing cost.

Description

technical field [0001] The invention relates to the technical field of electrostatic spraying, in particular to a spraying method and device for electrostatically spraying circuit boards. Background technique [0002] Using electrostatic spraying machine to spray circuit boards has high production efficiency and is easy to operate. The sprayed circuit boards have better quality assurance. Therefore, electrostatic spraying machines have been recognized by more and more circuit board manufacturers. [0003] Such as figure 1 As shown, the circuit board 12" to be sprayed is generally provided with copper skin, and the circuit board 12" will be clamped by the clamp 13", and grounded to keep the circuit board 12" in a zero potential state. When adopting spraying machine 14 " to spray the first plate surface of circuit board 12 ", because the ink sprayed by spraying machine 14 " is umbrella-shaped, and has negative charge, like this, when ink is sprayed to the edge of circuit boar...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a spraying method for electrostatically spraying circuit boards, aiming to solve the phenomenon of oil accumulation on the edges of the two boards of the circuit board when spraying the circuit board with a spraying machine in the prior art, so as to affect the quality of the circuit board and waste ink and the problem of increasing manufacturing costs

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