Printed circuit board

A technology of printed circuit boards and metal patterns, applied in the direction of printed circuits, printed circuits, printed circuit components, etc., can solve problems such as deviation from contemporary trends, space constraints, etc.

Inactive Publication Date: 2015-03-18
SAMSUNG ELECTRO MECHANICS CO LTD
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in view of the trend of slim and light electronic equipment, installing electrostatic protection components on PCBs creates space constraints in designing circuit diagrams and installing miniature components, making it possible to cause results that deviate from contemporary trends

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board
  • Printed circuit board
  • Printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] Various advantages and features of the present invention and techniques for realizing it will become apparent with reference to the accompanying drawings and the following description of exemplary embodiments. However, the present invention may be modified in various forms and should not be limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0031] The terms used in this specification are to explain the exemplary embodiments, not to limit the present invention. A singular form in this specification includes a plural form unless otherwise clearly stated to the contrary. The word "comprise" and variants such as "comprises" or "comprising" should be understood to mean the inclusion of stated components, steps, operations and / or elements, but not the exclusion of any other constituents. parts, st...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a printed circuit board. The printed circuit board comprises a grounding pattern, a protector and a spark gap between the grounding pattern and the protector. The printed circuit board is configured in a way that the printed circuit board is provided with a first spark gap connected to the grounding pattern and a second spark gap which is separated from the first spark gap, and static electricity generated by potential difference can be induced to the ground, and therefore parts which are sensitive to static electricity can be protected.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application Serial No. 10-2013-0105605, filed September 3, 2013, entitled "Printed Circuit Board," the entire contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a printed circuit board including a spark gap formed on a surface of a substrate to induce and connect static electricity to a ground. Background technique [0004] Since the trend of slimness and lightness of electronic equipment has increased the density of small mobile devices and other electronic products, spacing between components has narrowed and wiring density has increased so that abnormalities in product quality may be caused by electrostatic failures. Therefore, serious problems may be caused. [0005] In particular, microwave radio frequency (RF) devices have very low resistance to electrostatic discharge (ESD) shock. In fact, ESD pu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05F3/04
CPCH05K1/0227H05K2201/0707H05K1/0259H05K1/026H05K3/28
Inventor 金基锡李熙卿李相经
Owner SAMSUNG ELECTRO MECHANICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products