Gluing tape for SMT (surface mount technology) material strip connection and machining method thereof

A processing method and technology for sticking tapes, applied in the direction of adhesives, film/sheet adhesives, etc., can solve the problems of troublesome tape connection process, poor connection quality, affecting the processing efficiency of the assembly line, etc., and achieve the connection process. Simple, high connection quality, high connection efficiency

Active Publication Date: 2015-03-11
SHENZHEN BORWIN PRECISION MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a tape for connecting SMT tapes and its processing method to solve the problems in the prior art that the tape connection process is troublesome and the connection quality is poor, which affects the processing efficiency of the assembly line

Method used

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  • Gluing tape for SMT (surface mount technology) material strip connection and machining method thereof
  • Gluing tape for SMT (surface mount technology) material strip connection and machining method thereof
  • Gluing tape for SMT (surface mount technology) material strip connection and machining method thereof

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Embodiment Construction

[0030] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0031] figure 1 It is a flow chart of the processing method in the present invention; it includes the following steps: step S01, the adhesive tape includes adhesive film material and strip-shaped bottom paper 1, and the adhesive film on the bottom paper is processed into equidistant blocks of the same shape Adhesive film 2;

[0032] Step S02, punching the block-shaped adhesive film into the first adhesive film 21 and the second adhesive film 22 along the width direction of the strip-shaped backing paper, wherein the first adhesive film is larger than the second adhesive film;

[0033] Step S03, processing corresponding notches for positioning the first adhesive film and the second adhesive film on both sides of the...

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PUM

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Abstract

The invention relates to the field of gluing equipment, particularly to a gluing tape for SMT (surface mount technology) material strip connection and a machining method thereof. The method comprises steps as follows: the gluing tape comprises a gluing film material and strip-shaped base paper, and the gluing film material on the base paper is machined into block-shaped gluing films in the same shape at equal intervals; each block-shaped gluing film is die-cut into a first gluing film and a second gluing film in the width direction of the strip-shaped base paper, and each first gluing film is larger than each second gluing film; corresponding gaps for positioning the first gluing films and the second gluing films are machined in two side edges of the base paper respectively; slotted holes arranged side by side are die-cut in the first gluing films in the width direction of the strip-shaped base paper. With the adoption of the gluing tape and the machining method, large and small gluing films can be accurately identified no matter whether manual material strip connection or mechanical material strip connection is adopted, the material strip connection is finished smoothly, the connection process is simple, the connection efficiency is high, the connection quality is high, and the problem that the machining efficiency of production lines is affected by existing connection methods can be solved.

Description

technical field [0001] The invention relates to the field of gluing equipment, in particular to a gluing tape used for connecting SMT material tapes and a processing method thereof. Background technique [0002] As the automation of the assembly line is getting higher and higher, the processing efficiency is getting higher and higher, and because of the lack of manual processing, the yield rate of its products is also getting higher and higher. In the field of SMT or surface assembly, the material tape is often used manually The method of pasting, and the spacing of the components on the tape is fixed, after the connection, it is also necessary to ensure that the spacing of the components at the connection is the same as that of other components, and since there is no connection product designed for the material tape, not only The connection process is cumbersome, and after the connection occurs during the connection process, the two sections of the material tape at the conn...

Claims

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Application Information

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IPC IPC(8): C09J7/04C09J7/02
Inventor 郑鸿彪
Owner SHENZHEN BORWIN PRECISION MACHINERY
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