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Method for reinforcing reliability of plastic-substrate-contained three-dimensional circuit, and apparatus prepared by using the same

A three-dimensional circuit, reliability technology, applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems that affect the reliability of LDS circuits, life without circuit boards, deformation of plastic substrates, etc., to achieve enhanced adhesion and reliability Enhances, enhances the effect of a firm bond

Active Publication Date: 2015-03-04
COSONIC INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The plastic substrate used in the three-dimensional circuit is generally soft, and the plastic substrate used in the three-dimensional circuit is generally soft, and the life is not as long as the circuit board. In addition, the adhesion of the circuit formed by electroless plating on the surface of the substrate is poor, and some Some plastic substrates may be deformed, which will also affect the reliability of the LDS circuit

Method used

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  • Method for reinforcing reliability of plastic-substrate-contained three-dimensional circuit, and apparatus prepared by using the same
  • Method for reinforcing reliability of plastic-substrate-contained three-dimensional circuit, and apparatus prepared by using the same
  • Method for reinforcing reliability of plastic-substrate-contained three-dimensional circuit, and apparatus prepared by using the same

Examples

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Effect test

Embodiment 1

[0029] A method for enhancing the reliability of a three-dimensional circuit on a plastic substrate, comprising the following steps:

[0030] 1) First, form the through holes required to reinforce the three-dimensional circuit on the plastic structural member;

[0031] 2) Then the plastic structural parts with through holes obtained in step 1 are subjected to electroless plating, and in the process of electroless plating on the three-dimensional circuits on the plastic structural parts, the above-mentioned through holes form a metal layer through electroless plating to carry out the electroless plating on the three-dimensional circuits. reinforcement. Electroless plating is to place the plastic structural parts in the chemical plating pool. While forming the three-dimensional circuit on the surface of the plastic structural parts, a metal layer is chemically plated on the hole wall of the through hole, and the metal layer is attached to the hole wall. And connect the three-di...

Embodiment 2

[0043] A method for enhancing the reliability of a three-dimensional circuit on a plastic substrate, comprising the following steps:

[0044] 1) First, form the blind holes required to reinforce the three-dimensional circuit on the plastic structural parts;

[0045] 2) Then carry out electroless plating to the plastic structural parts with blind holes obtained in step 1. During the electroless plating process to the three-dimensional circuit on the plastic structural part, the above-mentioned through holes form a metal layer through electroless plating to carry out the electroless plating on the three-dimensional circuit. reinforcement. Electroless plating is to place the plastic structural parts in the chemical plating pool. While forming the three-dimensional circuit on the surface of the plastic structural parts, a metal layer is chemically plated on the hole wall of the blind hole, and the metal layer is attached to the hole wall. And connect the three-dimensional circuit...

Embodiment 3

[0055] A method for enhancing the reliability of a three-dimensional circuit on a plastic substrate, comprising the following steps:

[0056] 1) First, form the through holes and blind holes required to reinforce the three-dimensional circuit on the plastic structural parts;

[0057] 2) Then carry out electroless plating on the plastic structural parts with through holes and blind holes obtained in step 1. In the process of electroless plating on the three-dimensional circuit on the plastic structural parts, the above through holes and blind holes form a metal layer through electroless plating , to strengthen the three-dimensional circuit. Electroless plating is to place the plastic structural parts in the chemical plating pool. While forming the three-dimensional circuit on the surface of the plastic structural parts, a metal layer is chemically plated on the walls of the through holes and blind holes, and the metal layer is attached to the The three-dimensional circuit on t...

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Abstract

The invention relates to the technical field of the three-dimensional circuit and the apparatus, especially to a method for reinforcing reliability of a plastic-substrate-contained three-dimensional circuit, and an apparatus prepared by using the same. Compared with the prior art, the method comprises the following steps that: (1), a through hole and / or blind hole that are / is needed for reinforcing the three-dimensional circuit is formed in a plastic structural component; and (2), chemical plating is carried out on the plastic structure that is obtained by the step (1) and is provided with with the through hole and / or blind hole; and during the chemical plating process of the three-dimensional circuit of the plastic structural component, the through hole and / or blind hole is processed by the chemical plating to form a metal layer, thereby reinforcing the three-dimensional circuit. The metal layer attached to the through hole wall also plays a role in conducting the three-dimensional circuit at the two sides; and the adhesive forces of the three-dimensional circuit at the two sides are mutual enhanced, so that the three-dimensional circuit and the plastic substrate are combined firmly. The adhesive force is good, reliability is enhanced, and the service life of the three-dimensional circuit is prolonged. The apparatus prepared by using the method consists of a bluetooth earphone, a bluetooth box, an earphone wire control unit, a bluetooth bracelet or a bluetooth thermometer and the like and can be used widely.

Description

technical field [0001] The invention relates to the technical field of three-dimensional circuits and devices, in particular to a method for enhancing the reliability of a plastic-based three-dimensional circuit and a device for preparing the same. Background technique [0002] The plastic substrate used in the three-dimensional circuit is generally soft, and the plastic substrate used in the three-dimensional circuit is generally soft, and the life is not as long as the circuit board. In addition, the adhesion of the circuit formed by electroless plating on the surface of the substrate is poor, and some Some plastic substrates may be deformed, which will also affect the reliability of the LDS circuit. [0003] Therefore, there is an urgent need to provide a method for enhancing the reliability of a three-dimensional circuit on a plastic substrate and a device for preparing the same, so as to solve the deficiencies in the prior art. Contents of the invention [0004] One ...

Claims

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Application Information

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IPC IPC(8): H05K3/42C23C18/20C23C18/38
CPCC23C18/204C23C18/38H05K3/421H05K2203/072
Inventor 胡中骥胡平
Owner COSONIC INTELLIGENT TECH CO LTD
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