Femtosecond pulsed laser oscillator

A laser oscillator and femtosecond pulse technology, applied in the laser field, can solve the problems of photo-induced damage, difficult fiber laser light source large-scale production, poor consistency, etc. Effect

Active Publication Date: 2018-01-09
UNIV OF SHANGHAI FOR SCI & TECH
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  • Abstract
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  • Claims
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Problems solved by technology

Although the saturable absorber mode-locked laser has a simple structure, it is difficult to achieve fiber laser due to the poor product consistency of the saturable absorbing medium (such as semiconductor saturable absorbing mirror, graphene, carbon nanotubes) and the disadvantages of easy photoinduced damage. Ultra-large-scale production of light sources

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  • Femtosecond pulsed laser oscillator
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  • Femtosecond pulsed laser oscillator

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Embodiment Construction

[0032] The femtosecond pulsed laser oscillator of the present invention will be described in detail below with reference to the accompanying drawings. Those skilled in the art should understand that the embodiments described below are only illustrative illustrations of the present invention, and are not intended to limit it in any way. Throughout the drawings, the same reference numerals designate the same or similar parts.

[0033] Figure 1 to Figure 5 A preferred embodiment of the femtosecond pulsed laser oscillator of the present invention is shown. Such as figure 1 As shown, the femtosecond pulsed laser oscillator includes a pump light generating module 100 and a laser generating module 200 . Preferably, the pump light generating module 100 and the laser generating module 200 are connected and fixed by fasteners.

[0034] Specifically, as figure 2 As shown, the pump light generating module 100 includes a laser diode 101, a driving circuit 102 and a pump isolator 103...

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Abstract

The femtosecond pulse laser oscillator includes a pump light generating module and a laser generating module, the laser generating module includes a first fiber collimator and a second fiber collimator in the resonator, and the second fiber collimator emits a light path The first 1 / 4 wave plate, the first 1 / 2 wave plate, the polarization beam splitter crystal, the second 1 / 4 wave plate, the first grating, the second grating and the reflection mirror are arranged in sequence, and the polarization beam splits in the resonant cavity A second 1 / 2 wave plate and a third fiber collimator are arranged in sequence on the 90° first reflection light path of the crystal, and a third 1 / 4 wave plate is arranged on the 90° second reflection light path of the polarization beam splitter crystal. The first optical fiber collimator is arranged at the 90° second reflection optical path terminal of the vibrating beam splitter crystal; the front end of the cylindrical copper tube of the first optical fiber collimator is positioned and fixed in the U-shaped groove of the first pillar, and the tail end of the cylindrical copper tube is positioned and fixed in the U-shaped groove of the first pillar. Position and fix the first semi-cylindrical notch on the middle plane. The femtosecond pulsed laser oscillator can realize large-scale industrial production and has stable mode locking.

Description

technical field [0001] The invention belongs to the field of laser technology, in particular to a femtosecond pulse laser oscillator. Background technique [0002] Ultrashort pulse lasers have been developed since the 1980s. From the dye lasers that first used the principle of collision pulse mode-locking to the advent of mode-locked Ti:sapphire femtosecond lasers, femtosecond lasers have gradually been used in scientific research and industrial production. Opened up a new era of industrial processing. Experiments have proved that the unique time characteristics of femtosecond laser determine that it is an ideal high-precision processing tool, which can not only realize the material preparation of various materials, but also perform three-dimensional processing and modification on the inside of the material. Femtosecond pulsed lasers can be used for high-precision micromachining of industrial materials such as metals, metal carbides, and silicon wafers. Compared with nanos...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S3/10H01S3/13H01S3/067
Inventor 张青山郝强郭政儒曾和平
Owner UNIV OF SHANGHAI FOR SCI & TECH
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