A mechanically connected conduction-cooled semiconductor laser stack package structure

Abstract

The invention provides a mechanical connection conducting cooling type semiconductor laser unit stack packaging structure which is used for improving the reliability of a product and prolonging the service life of the product. On an insulation structure, a laser unit stack is located in the middle, a positive electrode connecting block and a negative electrode connecting block are located on the two sides of the laser unit stack, the positive electrode connecting block and the negative electrode connecting block are fixedly connected with a basic heat sink in the mode that fastening screws obliquely penetrate through the insulation structure downwards, the opposite inner side faces of the positive electrode connecting block and the negative electrode connecting block are both slopes, the two slopes are closed downwards overall, and the outer side faces at the two ends of the whole laser unit stack are also slopes which are matched with the two slopes respectively, so that under the screwing effect of the fastening screws arranged obliquely downwards, all chip modules are pressed to the middle and downwards through the positive electrode connecting block and the negative electrode connecting block, and therefore the mechanical connection conducting cooling type semiconductor laser unit stack packaging structure is finally acquired.

Description

technical field [0001] The invention belongs to the field of semiconductor laser packaging, and relates to a conduction cooling type semiconductor laser stack packaging structure. Background technique [0002] At present, the existing semiconductor laser packaging is generally to weld the laser chip on the heat sink, and solder the electrode connection block to the heat sink. If the laser chip is damaged or the electrode is connected to the semiconductor laser packaged in this way, If the block is damaged, the entire semiconductor laser device will no longer be usable, and the electrode connection block or laser chip cannot be replaced. In addition, there are many parts, the preparation process is difficult, and the yield rate is low, which also leads to relatively low reliability and long-term life of the product. [0003] For conduction-cooled high-power semiconductor laser arrays and liquid-cooled horizontal array high-power semiconductor laser arrays (a high-power semic...

AI Technical Summary

Problems solved by technology

[0002] At present, the existing semiconductor laser packaging is generally to weld the laser chip on the heat sink, and solder the electrode connection block to the heat sink. If the laser chip is damaged or the electrode is connected to the semiconductor laser packaged in this way, If the block is damaged, the entire semiconductor laser device will no longer be usable, and the electrode connection block or laser chip cannot be replaced

In addition, there are many parts, the preparation process is difficult, and the yield rate is low, which also leads to relatively low reliability and long-term life of the product

[0003] For conduction-cooled high-power semiconductor laser arrays and liquid-cooled horizontal array high-power semiconductor laser arrays (a high-power semiconductor laser, Chinese utility model patent, publication number CN101071933, publication date November 14, 2007), due to the horizontal array structure It is welded together by multiple bars. Once a bar is burned, short-circuited or not working properly, it will directly affect the output power and output beam of the entire laser, so it cannot be replaced

At the same time, the undamaged bars in the array will be wasted, so the manufacturing cost is very high

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