Fluorescent powder coating method capable of accurately controlling coating area

Abstract

The invention provides a fluorescent powder coating method capable of accurately controlling the coating area. The method is suitable for LED powder spray processes and includes the following steps that an LED substrate is fixed; a first baffle used for avoiding a gold wire and a wafer is placed; a second baffle provided with a spray hole is placed on the first baffle, the second baffle is higher than the highest points of the gold wire and the wafer, the spray hole exactly faces the LED wafer, and the size and the shape of the spray hole are matched with those of the wafer; a powder spray head is adjusted so as to exactly face the spray hole and conduct spray operation. According to the method, the wafer is arranged under the spray hole and the shape and the size of the spray hole are matched with those of the wafer located under the spray hole, so that the spray area is accurately determined through the size of the spray hole, and spray evenness is effectively controlled through the shape design of the spray hole.

Description

technical field [0001] The invention relates to LED spraying technology, in particular to a fluorescent powder coating method for precisely controlling the coating area. Background technique [0002] At present, white light LEDs are mostly packaged with blue light chips and phosphor powder. Phosphor powder coating mainly includes fluorescent glue dispensing technology and phosphor powder spraying technology. For products that do not have a bowl to carry fluorescent glue, the phosphor powder spraying technology is basically used, but the existing phosphor powder spraying will cover the entire substrate of the LED packaging product. Some will use a simple baffle to protect the gold wire and chip from the air, and press the baffle on the LED substrate, but the exposed area of ​​the substrate is still large, and most of the substrate will still be coated with phosphor. Moreover, because there is a certain gap between the baffle and the substrate of the LED packaging product, a ...

AI Technical Summary

Problems solved by technology

Compared with the method without a baffle, the spraying area is reduced when the baffle is set, but the coverage is still large, which may easily lead to uneven spraying, thereby affecting the luminous effect, and there is a capillary channel between the baffle and the substrate. Fluorescent glue 3a is easy to penetrate, and it is easy to cause sealing defects and affect the luminous effect

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