Composite circuit board and manufacturing method thereof

Abstract

The invention discloses a combined circuit board and a production method thereof. The combined circuit board comprises a flexible circuit board, rigid circuit boards, first conductive vias and second conductive vias. The flexible circuit board comprises a flexible dielectric layer and circuit layers arranged on the flexible dielectric layer. Each rigid circuit board comprises a rigid dielectric layer and a circuit layer comprising a main circuit and an out connection interface circuit. The rigid dielectric layers are arranged on the flexible circuit board. Each rigid dielectric layer comprises a first rigid dielectric portion and a second rigid dielectric portion which are spaced by a distance to enable part of the flexible circuit board to be exposed to the outside. Each main circuit is arranged on the corresponding first rigid dielectric portion. Each out connection interface circuit is arranged on the corresponding second rigid dielectric portion and comprises contacts. The first conductive vias are arranged in the second rigid dielectric portions and electrically connected with the contacts and the circuit layers of the flexible circuit board. The second conductive vias are arranged in the first rigid dielectric portions and electrically connected with the contacts and the circuit layers of the flexible circuit board.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a composite circuit board and a manufacturing method thereof. Background technique [0002] Generally speaking, an existing circuit board for carrying and electrically connecting a plurality of electronic components is mainly composed of a plurality of circuit layers and a plurality of dielectric layers stacked alternately. These circuit layers are defined by a conductive layer through a patterning process. The dielectric layers are respectively arranged between the adjacent circuit layers for isolating the circuit layers. In addition, the overlapping circuit layers can be electrically connected to each other through conductive vias. In addition, various electronic components (such as active components or passive components) can also be arranged on the surface of the circuit board, and the purpose of electrical signal propagation can be achieved through the ...

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Problems solved by technology

Therefore, the manufacturing process of the existing composite circuit board 100 is relatively complicated.

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